High-end packaging silver alloy bonding wire and method for manufacturing same

A silver alloy bond, high-end technology, applied in the field of bonding wire, can solve the problems that high-end packaging cannot be applied, the hardness of aluminum bonding wire is high, and the hardness cannot be solved, so as to achieve high strength, improve welding strength, and low arc length Effect

Active Publication Date: 2013-02-06
NINGBO KANGQIANG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, pure gold bonding wires inevitably lead to high cost
In recent years, the application of aluminum bonding wire has a tendency to further expand, but aluminum bonding wire has high hardness and the risk of easy oxidation, so it is only widely used in low-end packages.
Palladium-plated wire is a new bonding wire introduced to solve the problem of easy oxidation of aluminum wire, but it cannot solve the problem of high hardness. After palladium plating, the hardness is higher instead, and there is no way to apply it to high-end packaging.

Method used

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  • High-end packaging silver alloy bonding wire and method for manufacturing same

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Silver alloy bonding wire of the present invention is prepared according to the following process steps:

[0032] (1) Use silver with a purity of 99.99wt% to electrolytically purify high-purity silver with a purity of 99.999wt%; the silver with a purity of 99.99wt% as a raw material is commercially available common national standard No. 1 silver, and the raw material is purified to 99.999wt% by electrolysis wt%, the specific method is:

[0033] Commercially available silver is used as the anode, hung on the anode conductive rod, stainless steel material is used as the cathode, hung on the cathode conductive rod, and the anode and the cathode are kept parallel. Add silver nitrate solution (concentration 100 g / L) into the electrolytic cell as the electrolyte, and the current density is generally controlled at 260A / m 2 Range, cell voltage is generally controlled in the range of 2V, electrolysis temperature: 35-45°C, homopolar distance: 150mm;

[0034] (2) Adopt vertical ...

Embodiment 2

[0043] The method of Example 1 was repeated according to the content of each component specified in Table 1 below, and the performance test parameters are listed in Table 1.

[0044] Table 1 embodiment 1-5 product component content and product performance index

[0045]

[0046] The performance test parameters of each embodiment in Table 1 show that the silver alloy bonding wire of the present invention can meet the target, and has the characteristics of high strength and low arc length.

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Abstract

The invention discloses a high-end packaging silver alloy bonding wire. The high-end packaging silver alloy bonding wire is characterized by comprising 0.0001%-20% of gold, optional one or more than one of 0.0001%-20% of palladium, 0.0001%-20% of platinum, 0.0001%-0.015% of germanium, 0.0001%-0.015% of calcium and 0.0001%-1% of aluminum, and the balance silver. The invention further discloses a method for manufacturing the high-end packaging silver alloy bonding wire. The high-end packaging silver alloy bonding wire has the advantages of high strength and low hardness and long-arc degree.

Description

technical field [0001] The present invention relates to the field of bonding wire technology, in particular to a silver alloy bonding wire for high-end packaging (chip-level packaging CSP, that is, high-density, small and flat packaging design such as FBGA, QFN, substrate packaging, etc. called high-end packaging) and its preparation method. Background technique [0002] Traditional bonding wires are usually made of pure gold, which has better physical properties of elongation and electrical conductivity. However, pure gold bonding wires inevitably lead to high costs. In recent years, the application of aluminum bonding wire has a tendency to further expand, but aluminum bonding wire has high hardness and the risk of easy oxidation, so it is only widely used in low-end and mid-end packages. Palladium-plated wire is a new bonding wire introduced to solve the problem of easy oxidation of aluminum wire, but it cannot solve the problem of high hardness. After palladium plating...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C5/06H01L21/48
CPCH01L24/43H01L2224/45139H01L2224/43848H01L2924/00011H01L2224/43H01L2224/45H01L2924/01079H01L2924/01046H01L2924/01078H01L2924/01032H01L2924/0102H01L2924/01013H01L2924/01205H01L2924/20108H01L2924/20109H01L2924/2011H01L2924/20111H01L2924/013H01L2924/00H01L2924/01049H01L2924/00012H01L2924/01005
Inventor 李天祥郑康定郑芳郑磊
Owner NINGBO KANGQIANG ELECTRONICS CO LTD
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