Miniature type surface mounting single-phase full-wave bridge rectifier and manufacturing method of rectifier

Abstract

The invention discloses a miniature type surface mounting single-phase full-wave bridge rectifier and a manufacturing method of the rectifier. The miniature type surface mounting single-phase full-wave bridge rectifier is composed of a monolithic frame unit and a lower pin unit, wherein the monolithic frame unit and the lower pin unit comprise 5 components forming a rectification chip of a bridge rectifier circuit, namely, two input terminals as one group, two output terminals as one group, two connection jumpers as one group, four chips as one group and a plastic package body. In comparison with the prior art, the miniature type surface mounting single-phase full-wave bridge rectifier provided by the invention has the following advantages that the total thickness of the mechanism of the rectifier can be halved in comparison with the prior art, and simultaneously, the influence of the material cutting rigidity in the manufacturing procedure on the realized chips is completely eradicated; after the miniature type surface mounting single-phase full-wave bridge rectifier is welded on a PCB (Printed Circuit Board), the vertical distance and the transverse distance from the chips (heat source) to the welding spots on the PCB both are very short, consequentially, the thermal resistance between the chips and the welding spots is very low, so that the heat dissipation efficiency can be improved greatly, and the work of the rectifier can be more steady.

Description

technical field [0001] The invention relates to a miniature semiconductor device, in particular to a miniature single-phase full-wave bridge rectifier and a manufacturing method thereof. Background technique [0002] The conversion from AC to DC for a small current (generally ≦1A) is necessary in almost all miniature devices. This process is called rectification, and its purpose is to provide a stable DC power supply for the operation of the device. There are two ways to achieve rectification: one is to use discrete devices to form a rectification circuit on the PCB to realize rectification conversion. This method is complex and not conducive to miniaturization; The degree of miniaturization of this device depends on the spatial arrangement density of the chips during the device packaging process and the precise positioning of the rectifier chips in the device in the micro space. With the gradual improvement of miniaturization requirements for low-power equipment, on the o...

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Problems solved by technology

However, the device has the following disadvantages: 1. Rhombus arrangement: Since the plastic package is a square structure, the four chips arranged in a diamond shape are all distributed on the four sides of the plastic package, and the top corners are very close to the edge of the plastic package, which is limited by the protection of the plastic package. 2. The structure disclosed in this document is divided into two parts. During production, there is cutting of upper and lower copper materials, which causes temperature changes and increases lateral shear force. As we all know, chip silicon materials are resistant to pressure but not Shear force, so the hard force on the chip will seriously affect the final performance of the product

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