A kind of manufacturing method of LED package substrate with high thermal conductivity
A technology of LED packaging and manufacturing method, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of unsuitability for popularization, complex silicon substrate manufacturing process, high cost, easy operation, high heat conduction and heat dissipation efficiency, and production cycle. short effect
Active Publication Date: 2016-01-13
惠州市志金电子科技有限公司
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Problems solved by technology
However, the current production and packaging of silicon substrates have the defects of complex manufacturing process and high cost, which are not suitable for popularization and use.
Method used
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Embodiment 4
[0040] The difference between this embodiment and Embodiment 1 is that when the insulating protective ink is removed, a 35% NaOH solution is used as the potion, and the substrate coated with the insulating protective ink is immersed in the potion, and the soaking time is 3- 5min, then rinse off.
Embodiment 5
[0042] The difference between this embodiment and Embodiment 1 is that when the insulating and protective ink is removed, a 45% NaOH solution is used as the potion, and the substrate coated with the insulating and protective ink is immersed in the potion, and the soaking time is 3- 5min, then rinse off.
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The invention discloses a manufacturing method for an LED (Light-emitted Diode) package substrate with high thermal conductivity. The manufacturing method comprises the steps of: 1) providing a base material, wherein the base material comprises an insulating substrate, and conductive layers are covered on front and back surfaces of the insulating substrate; 2) drilling in the base material; 3) inserting a heat conduction needle into a drill hole in the base material; 4) coating insulating protective printing ink on the front and back surfaces of the base material; 5) etching the conductive needle to enable the conductive needle to be parallel to the conductive layer; 6) removing the insulating protective printing ink; 7) manufacturing a circuit layer on the conductive layer; and 8) routing a solid crystal. According to the manufacturing method disclosed by the invention, the manufacture process is simple, the period is short and the cost is low; the manufactured product is quick in radiating and suitable for a high-power LED lamp.
Description
technical field [0001] The invention relates to the technical field of LED semiconductors, in particular to a manufacturing method of a high thermal conductivity LED packaging substrate. Background technique [0002] LED is a light-emitting diode, which is a solid-state semiconductor device that can convert electrical energy into visible light. It is widely used due to its advantages of small size, low power consumption, long service life, high brightness, and environmental protection. Currently, most LEDs are directly packaged on general resin substrates. However, with the development of high-brightness and high-efficiency LEDs, especially the luminous efficiency of blue LED components has been greatly improved, LEDs are widely used in liquid crystals, home appliances, automobiles, etc. wider. Electrical equipment using high-power LEDs has higher requirements on the thermal conductivity and heat dissipation efficiency of the packaging substrate on which the LED is mounted...
Claims
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IPC IPC(8): H01L33/48H01L33/64H01L33/62
Inventor 康孝恒
Owner 惠州市志金电子科技有限公司