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Forming device of semiconductor glass pipe for volume conductive microchannel plate

A technology of micro-channel plate and forming device, applied in glass forming, glass pressing, glass manufacturing equipment and other directions, can solve problems such as unseen, inability to manufacture semiconductor glass tubes, dependence, etc., and achieve high forming efficiency and overall Concise structure and easy operation

Inactive Publication Date: 2013-02-20
CHANGSHU XINLI MAGNETIC IND
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

Therefore, the common and popular drawing method for manufacturing glass tubes cannot be used to manufacture semiconductor glass tubes.
Seek a manufacturing method for semiconducting glass tubes that does not stay at the "working point" temperature; that is, instead of blowing molding, extrusion molding is used, and the molding operation is started at a lower temperature, and the entire molding process is lower than the "working point" temperature It is a method recognized by the industry at present, but the extrusion molding method needs to rely on the corresponding molding device, and there is no technical inspiration for such a molding device in the published literature

Method used

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  • Forming device of semiconductor glass pipe for volume conductive microchannel plate

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Embodiment Construction

[0022] In order to enable the examiners of the patent office, especially the public, to understand the technical essence and beneficial effects of the present invention more clearly, the applicant will describe in detail the following in the form of examples, but none of the descriptions to the examples is an explanation of the solutions of the present invention. Any equivalent transformation made according to the concept of the present invention which is merely formal but not substantive shall be regarded as the scope of the technical solution of the present invention.

[0023] See figure 1 , a frame-type frame 1 is provided, a heating furnace 2 is fixed on the top of the frame 1, and the heating furnace 2 has an open hearth 21. On the outer wall of the heating furnace 2, a plurality of S-shaped The heating pipe 22 is laid around the heating furnace 2 in a curved circulation mode. The heating pipe 22 is an electric heating pipe and is electrically connected with an elect...

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Abstract

The invention relates to a forming device of a semiconductor glass pipe for a volume conductive microchannel plate, belonging to the technical field of forming machinery of special glass products. The forming device comprises a framework, a heating furnace, a die, a compressing mechanism and a glass pipe traction mechanism, wherein the heating furnace is provided with a furnace chamber and is arranged close to the middle part of the framework; the die is fixed at the bottom of the heating furnace and is communicated with the furnace chamber; the compressing mechanism is arranged at the top of the framework and extends into the furnace chamber; and the glass pipe traction mechanism is arranged on the framework and is correspondingly arranged below the heating furnace. The forming device has the following advantages: the forming speed is so high that the temperature can be prevented from approaching the working point of the semiconductor glass material, thereby avoiding the volatilization of the phosphorus oxide component in the glass to prevent the change of the surface chemical composition of the glass, and avoiding the devitrification of the glass; due to the adoption of the compressing structure, the forming efficiency is high, thereby being beneficial to meeting industrial scale-up production requirements; through the replacement with different dies, a glass pipe having a required wall thickness can be obtained, thereby meeting requirements of the microchannel plate; and the overall structure is simple, thereby facilitating the operation.

Description

technical field [0001] The invention belongs to the technical field of forming machinery for special glass products, and in particular relates to a semiconductor glass tube forming device for bulk conductance microchannel plates. Background technique [0002] The aforementioned volume conductance microchannel plate is also called volume conduction microchannel plate, and the microchannel plate (English: Microchannel Plate, MCP for short) is a large area array high spatial resolution electron multiplication detector, and has a very high Time resolution, mainly used in high-performance night vision image intensifiers, and widely used in various scientific research fields. The micro-channel plate uses a glass sheet as a carrier, and micropores with a diameter slightly smaller than the space period are arranged in a hexagonal period on the glass sheet with a space period of a few microns to a dozen or even tens of microns. Typically, there are about one million microchannels on...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03B11/00C03B11/10C03B11/16
Inventor 曾欲强易家良潘守芹晏润铭王荣杰
Owner CHANGSHU XINLI MAGNETIC IND