Heat-conduction electronic potting adhesive and preparation method thereof

A potting and electronic technology, applied in the directions of adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve the problem that the potting requirements of electronic components cannot be effectively met, the application fields of potting adhesives are limited, spherical fillers Expensive and other problems, to achieve the effect of heat dissipation, improved service life, and low viscosity

Inactive Publication Date: 2013-02-27
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to achieve this requirement, it is necessary to add a large amount of thermally conductive and flame-retardant inorganic fillers when preparing the potting compound. Due to the poor compatibility between the filler and the base compound, it is easy to cause the viscosity of the potting compound to increase and the strength to decrease, resulting in poor fluidity. , low strength, unable to effectively meet the potting requirements of electronic components
The application of spherical fillers can solve this problem to a certain extent, but due to the high price of spherical fillers, the final price of the product is high, which limits the application fields of potting compounds

Method used

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  • Heat-conduction electronic potting adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Put 2560.00g of irregular silica powder with an average particle size of 10μm, 6400.00g of irregular alumina powder with an average particle size of 60μm, and 3840.00g of aluminum hydroxide powder with an average particle size of 20μm in the container , Dilute 25.60g of silane coupling agent γ-aminopropyltriethoxysilane with 512.00g of absolute ethanol, add it to the heat-conducting and flame-retardant powder, stir it evenly, and place it in a ball mill. Put it into a ball mill for ball milling modification. After grinding for 2 hours, take it out and dry it, and continue grinding for 1 hour to obtain a modified heat-conducting and flame-retardant powder.

[0036] Accurately weigh 2592.00 g of vinyl-terminated silicone oil and 12825.60 g of modified heat-conducting and flame-retardant powder, add them to a vacuum kneader in sequence, and knead in vacuum at 120-130° C. for 4 hours to obtain a base material.

[0037] Accurately weigh 6156.80g of base material, 192.00g of...

Embodiment 2

[0042] Put 2305.00g of irregular silicon oxide powder with an average particle size of 5 μm, 3455.00 g of irregular silicon oxide powder with an average particle size of 13 μm, and 3840.00 g of magnesium hydroxide powder with an average particle size of 40 μm in the container, Dilute 48.00g of silane coupling agent γ-(2,3-glycidoxy)propyltrimethoxysilane with 960.00g of absolute ethanol, add it to the heat-conducting and flame-retardant powder, stir evenly, and place it in a ball mill. Put it into a ball mill for ball milling modification. After grinding for 2 hours, take it out and dry it, and continue grinding for 1 hour to obtain a modified heat-conducting and flame-retardant powder.

[0043] Accurately weigh 4,800.00 g of vinyl silicone oil and 9,648.00 g of modified heat-conducting and flame-retardant powder, add them to a vacuum kneader in sequence, and knead in vacuum at 120-130° C. for 3 hours to obtain a base material.

[0044] Accurately weigh 5760.00g of base mater...

Embodiment 3

[0049] Put 1920.00g of irregular silica powder with an average particle size of 2μm, 3200.00g of irregular alumina powder with an average particle size of 20μm, and 1280.00g of titanium oxide powder with an average particle size of 13μm in the container, Dilute 64.00g of silane coupling agent γ-(2,3-glycidoxy)propyltrimethoxysilane with 1280.00g of absolute ethanol, add it to the heat-conducting and flame-retardant powder, stir evenly, and place it in a ball mill. Put it into a ball mill for ball milling modification. After grinding for 2 hours, take it out and dry it, and continue grinding for 1 hour to obtain a modified heat-conducting and flame-retardant powder.

[0050] Accurately weigh 7040.00g of vinyl-terminated silicone oil and 6464.00g of modified heat-conducting and flame-retardant powder, add them to a vacuum kneader in turn, and knead in vacuum at 120-130°C for 3 hours to obtain a base material.

[0051] Accurately weigh 5376.00g of the base material, 928.00g of t...

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Abstract

The invention relates to the field of a potting adhesive and particularly relates to a low-viscosity heat-conduction electronic potting adhesive applicable to each electronic element and a preparation method thereof. The heat-conduction electronic potting adhesive is formed by a component A and a component B in a weight ratio from 100: 90 to 100: 110; the component A comprises the following raw materials in weight percentage of 39.20-79.60% of heat-conduction inflaming retarding powder, 0.80-2.00% of color matching agent, 0.40-1.00% of silane coupling agent, 16.20-43.80% of liquid silicon oil and 3.00-14.50% of silane cross-linking agent; and the component B comprises the following raw materials in weight percentage of 39.20-79.60% of heat-conduction inflaming retarding powder, 18.00-57.80% of liquid silicon oil, 0.20-1.00% of silane coupling agent, 1.00-1.96% of color matching agent and 0.04-1.00% of catalyst. The low-viscosity heat-conduction electronic potting adhesive has lower viscosity, excellent mobility, good heat-conduction performance and high inflaming retarding grade; the potting requirement of a seam less than 0.02 mm can be met and the construction is convenient; and after the heat-conduction electronic potting adhesive is cured, the strength is good, and the dustproof, moisture-proof and vibration-proof performances are good, the electronic element can be effectively protected and the service life of the electronic element is prolonged.

Description

technical field [0001] The invention relates to the field of potting adhesives, in particular to a low-viscosity heat-conducting electronic potting adhesive suitable for various electronic components and a preparation method thereof. Background technique [0002] Silicone potting materials have a wide working temperature range, excellent high and low temperature impact resistance, no heat absorption or heat release during curing, no shrinkage after curing, excellent electrical properties and chemical stability, good corrosion resistance, weather resistance, and excellent thermal conductivity The advantages. Used as electronic potting material, it can play the role of dust-proof, moisture-proof, vibration-proof, heat conduction, and improve the stability of electronic components. Compared with traditional condensation-type electronic potting adhesives, addition-type electronic potting adhesives have the advantages of no low-molecular by-products, no corrosion, easy control o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J11/04
Inventor 唐丽王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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