Process for welding electronic microcomponents based on multi-temperature gradient

Abstract

The invention discloses a process for welding electronic microcomponents based on a multi-temperature gradient. The process is simple, convenient, efficient, stable and reliable in processing quality, good in welding flowability and little in welding hollows. The process is realized by the following technical scheme: designing the temperature gradient of welding fluxes according to melting points of different welding fluxes and respectively manufacturing welding flux slices at different temperature gradients from a secondary high temperature to a minimum temperature; dividing a function substrate and a transition parent plate on each electronic microcomponent into welding surfaces of the welding fluxes at different temperature gradients and coating a welding flux film coating layer on the welding surfaces directly and respectively by sputter coating; arranging welding flux thickness control pins at more points on the welding surfaces of the electronic component; laminating the electronic microcomponents (1), the welding flux slices (3) and the substrate component (5) sequentially, putting into a clamp with a counter-recoil pressure holding mechanism and putting the clamp into a furnace for vacuum welding; firstly completing the welding at a high temperature gradient, and then protecting other surfaces, which are not used for the welding at the next temperature gradient, of the substrate component, and coating one welding flux film coating layer on the welding surfaces respectively by the sputter coating at the next temperature gradient.

Description

technical field [0001] The invention relates to a process method for multi-temperature cascade welding of electronic micro-components, in particular to a micro-assembly process method that requires high-precision temperature control and welding of electronic micro-components to be integrated into electronic components. Background technique [0002] In the micro-assembly process of multi-functional electronic components, welding involves the reliability and quality of the product, which directly affects the electrical performance index of the product and the product environmental adaptability assessment and acceptance review. In addition, due to the rapid development of electronic components in the direction of lightness, thinness and smallness, a series of welding process problems have been raised. For this reason, manufacturers of complete electronic equipment have launched fierce competition around the welding process of electronic components, especially TR components. Fur...

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Problems solved by technology

[0005] The purpose of the present invention is to address the problems in the prior art above, and provide a simple, convenient, high-efficiency, stable and reliable processing quality, good welding fluidity, and less welding voids. There are few welding temperature steps for electronic TR components, low multi-functional integration, limited thermal expansion mismatch of lightweight materials, poor stability and consistency of welding indicators, and difficult quantitative flaw detection.

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