Copper foil substrate for flexible printed circuit boards

A flexible printing and copper foil substrate technology, which is applied in the direction of circuit substrate materials, printed circuit components, layered products, etc., can solve problems such as complicated production procedures, easy-to-interpret circuit design distribution, and affect product market sales and company operations. , to achieve the effect of high heat dissipation, high brightness and heat dissipation

Active Publication Date: 2013-03-06
KUSN APLUS TEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Usually, the problem with the application of polyimide copper foil substrates is that the composition and thickness of the polyimide material are limited, so that the formed polyimide layer is mostly yellow or other highly transparent Chromaticity, resulting in subsequent use in soft boards, due to the light transmittance of the polyimide layer, the circuit design distribution of the

Method used

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  • Copper foil substrate for flexible printed circuit boards
  • Copper foil substrate for flexible printed circuit boards
  • Copper foil substrate for flexible printed circuit boards

Examples

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Effect test

Example Embodiment

[0025] Example 1: figure 1 Shown is the copper foil substrate 100 for a flexible printed circuit board of Embodiment 1 of the present invention, which is presented in the form of a double-sided board. The copper foil substrate 100 is provided with a first copper foil 101a, a polyimide layer 102, and a second A reflective layer 103 and a second copper foil 101b.

[0026] The first copper foil 101a and the second copper foil 101b in this example can be electrolytic copper foil or rolled copper foil, and in application, usually the thickness of the first copper foil 101a and the second copper foil 101b can range from 9 to 35 microns, and the thickness difference between the first copper foil and the second copper foil is less than 26 microns.

[0027] In order to reduce the transmittance of the manufactured flexible circuit board and reduce the occurrence of problems such as incomplete heat dissipation, the copper foil substrate of the present invention has a thin but thin thickness b...

Example Embodiment

[0035] Example 2: figure 2 Shown is a copper foil substrate 200 for a flexible printed circuit board of the second embodiment of the present invention. The copper foil substrate of this example is a double-sided copper foil substrate with a first copper foil 201a, a polyimide layer 202, and a second copper foil substrate. A reflective layer 203a, a second reflective layer 203b and a second copper foil 201b.

[0036] The difference between the copper foil substrate 100 of this embodiment and the embodiment 1 is that this embodiment further includes a second reflective layer 203b formed between the first copper foil 201a and the polyimide layer 202. The second reflective layer 203b is selected from epoxy resin, acrylic resin, urethane resin, silicone rubber resin, parylene resin and bismaleimide resin (Bismaleimide resin) One or more resins in the group consisting of resins, and one or more additives selected from the group consisting of white pigments, titanium dioxide and boron...

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Abstract

The invention discloses a copper foil substrate for flexible printed circuit boards. The copper foil substrate comprises a first copper foil, a polyimide layer and a second copper foil, wherein the polyimide layer is positioned between the first copper foil and the second copper, the thickness of the polyimide layer ranges from 7 micrometers to 150 micrometers, a first reflective layer is arranged between the second copper foil and the polyimide layer, or further, a second reflective layer is arranged between the first copper foil and the polyimide layer. The copper foil substrate with small thickness and low lightness can be obtained by adjusting the thickness of the polyimide layer, and the lightness of the copper foil substrate can be changed by adjusting content of additives contained in the first reflective layer and the second reflective layer. In addition, compared with the conventional copper foil substrate, the copper foil substrate has the advantages of higher lightness and higher heat dissipation, and meets requirements on white shielding or heat dissipation for flexible copper foil circuit substrates of electronic products.

Description

technical field [0001] The invention relates to a copper foil substrate, in particular to a copper foil substrate used for a flexible printed circuit board. Background technique [0002] At present, electronic systems are developing in the direction of lightness, thinness, high heat resistance, multi-functionality, high density, high reliability, and low cost. Therefore, the selection of substrates has become a very important factor. A good substrate must have material properties of high thermal conductivity, high color shielding effect, high heat dissipation, high heat resistance, and low thermal expansion coefficient. Polyimide resin has high thermal stability and excellent heat dissipation, mechanical strength, and adhesiveness, and is often used in various electronic materials, such as flexible printed circuit boards (Flexible Printed Circuit). [0003] Polyimide resin has been widely used in electronic materials, among which, the polyimide copper foil substrate used fo...

Claims

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Application Information

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IPC IPC(8): B32B15/08B32B15/20B32B27/18H05K1/03
Inventor 林志铭李建辉洪金贤金进兴
Owner KUSN APLUS TEC CORP
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