Copper foil substrate for flexible printed circuit boards

A flexible printing and copper foil substrate technology, which is applied in the direction of circuit substrate materials, printed circuit components, layered products, etc., can solve problems such as complicated production procedures, easy-to-interpret circuit design distribution, and affect product market sales and company operations. , to achieve the effect of high heat dissipation, high brightness and heat dissipation
CN102950835AActive Publication Date: 2013-03-06KUSN APLUS TEC CORP
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Patent Information

Authority / Receiving Office
CN Β· China
Current Assignee / Owner
KUSN APLUS TEC CORP
Publication Date
2013-03-06

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Abstract

The invention discloses a copper foil substrate for flexible printed circuit boards. The copper foil substrate comprises a first copper foil, a polyimide layer and a second copper foil, wherein the polyimide layer is positioned between the first copper foil and the second copper, the thickness of the polyimide layer ranges from 7 micrometers to 150 micrometers, a first reflective layer is arranged between the second copper foil and the polyimide layer, or further, a second reflective layer is arranged between the first copper foil and the polyimide layer. The copper foil substrate with small thickness and low lightness can be obtained by adjusting the thickness of the polyimide layer, and the lightness of the copper foil substrate can be changed by adjusting content of additives contained in the first reflective layer and the second reflective layer. In addition, compared with the conventional copper foil substrate, the copper foil substrate has the advantages of higher lightness and higher heat dissipation, and meets requirements on white shielding or heat dissipation for flexible copper foil circuit substrates of electronic products.
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Description

technical field

[0001] The invention relates to a copper foil substrate, in particular to a copper foil substrate used for a flexible printed circuit board. Background technique

[0002] At present, electronic systems are developing in the direction of lightness, thinness, high heat resistance, multi-functionality, high density, high reliability, and low cost. Therefore, the selection of substrates has become a very important factor. A good substrate must have material properties of high thermal conductivity, high color shielding effect, high heat dissipation, high heat resistance, and low thermal expansion coefficient. Polyimide resin has high thermal stability and excellent heat dissipation, mechanical strength, and adhesiveness, and is often used in various electronic materials, such as flexible printed circuit boards (Flexible Printed Circuit).

[0003] Polyimide resin has been widely used in electronic materials, among which, the polyimide copper foil substrate used fo...

Claims

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