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A flame-retardant copper-clad laminate coated with phosphorus-containing and halogen-free solids and its preparation method

A copper-clad laminate, solid technology, applied in chemical instruments and methods, aldehyde/ketone condensation polymer adhesives, epoxy resin adhesives, etc. Oxygen resin hardening adverse effects and other problems, to achieve good toughness and peel strength, good heat resistance and flame retardancy

Active Publication Date: 2016-03-23
NANYA NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the following problems still exist in these flame-retardant resin compositions: it has adverse effects on the hardening of epoxy resin, reduces the heat resistance of the hardened composition or makes the hardened composition brittle and has low peel strength.

Method used

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  • A flame-retardant copper-clad laminate coated with phosphorus-containing and halogen-free solids and its preparation method
  • A flame-retardant copper-clad laminate coated with phosphorus-containing and halogen-free solids and its preparation method
  • A flame-retardant copper-clad laminate coated with phosphorus-containing and halogen-free solids and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0076] (1) prepare adhesive

[0077] The mass percentage of solids in the binder used is 65.2%, and the rest is organic solvents (such as propylene glycol methyl ether). Wherein, the formula of solids is shown in Table 4 (by weight)

[0078] Table 4

[0079]

[0080] 1) Add 106Kg of organic solvent into the stirring tank according to the above weight, turn on the stirrer at a speed of 600 rpm, keep stirring continuously and control the temperature of the tank at 40°C, then add aluminum hydroxide and silicon dioxide, and continue to Stir for 20 minutes;

[0081] 2) Add phosphorus-containing epoxy resin, isocyanic acid-modified epoxy resin, phosphorus-containing curing agent, and phenolic resin in sequence according to the formula amount in the stirring tank, and keep stirring at 1000 rpm during the feeding process. Then turn on high-efficiency shearing and emulsification for 3 hours, and at the same time carry out cooling water circulation to keep the temperature of the co...

Embodiment 2

[0099] (1) Preparation of adhesive

[0100] The mass percentage of solids in the adhesive used is 66%, and the rest is organic solvents (such as propylene glycol methyl ether). Wherein, the formula of solids is shown in Table 6 (by weight)

[0101] Table 6

[0102]

[0103] 1) Add 98Kg of organic solvent propylene glycol methyl ether into the stirring tank according to the above weight, turn on the stirrer at a speed of 600 rpm, keep stirring continuously and control the temperature of the tank at 40°C, then add aluminum hydroxide and silicon dioxide, add Continue stirring for 20 minutes after completion;

[0104] 2) Add phosphorus-containing epoxy resin, isocyanic acid-modified epoxy resin, phosphorus-containing curing agent, and phenolic resin in sequence according to the formula amount in the stirring tank, and keep stirring at 1000 rpm during the feeding process. Then turn on high-efficiency shearing and emulsification for 3 hours, and at the same time carry out cooli...

Embodiment 3

[0122] (1) Preparation of adhesive

[0123] The mass percentage of solids in the adhesive used is 66%, and the rest is organic solvents (such as propylene glycol methyl ether), wherein the formula of solids is shown in Table 8 (by weight)

[0124] Table 8

[0125]

[0126] 1) Add 99Kg of organic solvent propylene glycol methyl ether into the stirring tank according to the above weight, turn on the stirrer at a speed of 600 rpm, keep stirring continuously and control the temperature of the tank at 40°C, then add aluminum hydroxide and silicon dioxide, add Continue stirring for 20 minutes after completion;

[0127] 2) Add phosphorus-containing epoxy resin, isocyanic acid-modified epoxy resin, phosphorus-containing curing agent, and phenolic resin in sequence according to the formula amount in the stirring tank, and keep stirring at 1000 rpm during the feeding process. Then turn on high-efficiency shearing and emulsification for 3 hours, and at the same time carry out coolin...

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Abstract

The invention relates to a flame-retarding copper clad laminate coated with solid content containing phosphorous and no halogen and a preparation method thereof. The flame-retarding copper clad laminate is prepared from an adhesive, glass fiber cloth and a copper foil. The adhesive is prepared from 50-90wt% of solid content and the balance of an organic solvent; and the solid content is prepared from the following components in percentage by weight: 5%-50% of phosphorous epoxy resin, 10%-60% of carbimide-modified epoxy resin, 1%-35% of phosphorus curing agent, 1%-30% of phenolic resin, 10%-60% of inorganic filler, and 0.002%-0.015% of epoxy resin curing accelerator. The copper clad laminate has the advantages of favorable heat resistance and flame retardancy as well as favorable toughness and peel strength, and the copper clad laminate is suitable for the production of multilayer laminate in the PCB (printed circuit board) industry.

Description

technical field [0001] The invention relates to the technical field of copper foil board preparation, in particular to a flame-retardant copper clad board coated with phosphorus-containing and halogen-free solids and a preparation method thereof. Background technique [0002] With the recent focus on global environmental issues, regulations regarding the formation of toxic substances in the disposal of electrical and electronic products are becoming more stringent. Conventional resin compositions usually used for prepregs and laminates use brominated difunctional epoxy resins and multifunctional epoxy resins as main components, use amino curing agents and curing accelerators, wherein epoxy resins contain 15- 20wt% bromine to comply with UL (Underwriters Laboratory Underwriters Laboratories) flame retardant standards. [0003] Bromine-containing halides have excellent flame retardancy, but generate toxic chlorine during their combustion. Since halogen-containing substances ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B15/14B32B17/02B32B7/12B32B37/06B32B37/10B32B37/12B32B38/16C09J163/00C09J163/04C09J161/06C09J11/04
Inventor 况小军席奎东包欣洋张东包秀银
Owner NANYA NEW MATERIAL TECH CO LTD
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