Micro-processing method and system for pulse laser fragile material

Abstract

The invention relates to a micro-processing method and system for a pulse laser fragile material. The method comprises the steps of: carrying out micro-processing by focusing pulse laser on the surface of a workpiece of the fragile material in water, wherein the frequency of pulse laser is greater than 2Hz, the power density is GW / cm<2> order, the pulse width is 20-50ns; the fragile material is silicon, gallium arsenide or glass. Laser beams output by a pulse laser controlled by a laser control unit of the system are focused on the surface of the workpiece in water in a container through a reflector and a focusing lens. The container is fixedly arranged on a two-dimensional translational worktable, wherein the frequency of pulse laser is greater than 2Hz, and the power density is GW / cm<2> order. A water inlet of a micro pump is connected with a water pool, while a water outlet of the micro pump is connected with the container. X-axis and Y-axis servo motor driving worktables connected to and controlled by a computer translate two-dimensionally. The invention provides the novel method and system for large depth-to-width ratio micro-processing on the fragile material by pulse laser in water, wherein the depth-to-width ratio can reach 3.

Description

technical field [0001] The invention belongs to the field of laser processing, and in particular relates to a pulse laser microprocessing method and system for brittle materials. Background technique [0002] The laser direct engraving process has the advantages of high resolution and pattern transfer without special masks, so it is widely used in the field of etching processing. [0003] However, for brittle materials such as silicon, gallium arsenide, and glass, the aspect ratio of micropores or thin lines in the current laser etching process can generally only reach about 1, and the value of ordinary electrochemical etching is even smaller. The etching process of brittle materials with large aspect ratio is still under study. Contents of the invention [0004] The object of the present invention is to provide a pulse laser micromachining method for brittle materials in water. The micropores have an aspect ratio of more than 1 or even up to 3. [0005] Another object o...

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Problems solved by technology

[0003] However, for brittle materials such as silicon, gallium arsenide, and glass, the aspect ratio of micropores or thin lines in the current laser etching process can only reach about 1, and the value of ordinary electrochemical etching is even smaller.

Etching processing of brittle materials with large aspect ratio is still under study

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