Single-chip packaging piece with adhesive film replacing bottom fillers and manufacture process thereof
A manufacturing process and single-chip technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as easy warpage and unguaranteed packaging reliability, achieve good protection of solder balls, reduce Possibility of wafer warpage, effect of reducing packaging cost
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[0022] As shown in the figure, a single-chip package with an adhesive film instead of an underfill is mainly composed of a substrate 1, a nickel-gold pad 2, a chip 3, a tin-silver bump 4, an adhesive film 5, and a solder ball 8; The nickel-gold pad 2 is fixedly connected to the substrate 1, and the tin-silver bump 4 is fixedly connected to the chip 3; the tin-silver bump 4 coincides with the center line of the nickel-gold pad 2 and is connected by welding; the adhesive film 5 The gap between the substrate 1 and the chip 3 is filled, and the nickel-gold pad 2 and the tin-silver bump 4 are surrounded.
[0023] The chip 3 constitutes a circuit power supply and signal channel through tin-silver bumps 4 , nickel-gold pad 2 , substrate 1 and tin balls 8 .
[0024] As shown in the figure, a manufacturing process of a single-chip package with an adhesive film instead of an underfill is carried out in the following steps:
[0025] The first step, adhesive film 5: First, uniformly spin...
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