53results about How to "Reduce the chance of warping" patented technology

The invention discloses a separator and a lithium ion battery. The separator comprises a separator substrate and an organic coating, wherein the organic coating is formed by distributing a cohesive organic polymer on a single surface or double surfaces of the separator substrate in a form of space dispersed and coated strips with specified thickness. Uniformly distributed concave and convex interval zones are shown on the surface of the separator in a manner of multi-space dispersed and coated strip-shaped organic coatings, a certain buffer space is reserved between a positive pole and a negative pole, stress produced by positive and negative pole pieces because of swelling in the charge-discharge process is released, and the probability of distortion in the cycle process of the lithium ion battery is greatly reduced; the internal resistance of the battery is reduced while the better adhesion effect with the positive and negative poles is guaranteed; besides, a channel is provided forinfiltration and circulation of an electrolyte, and the cycle life of the lithium ion battery is prolonged.

The invention discloses a single-chip packaging piece with an adhesive film replacing bottom fillers and manufacture process thereof. The packaging piece is mainly composed of a substrate, a nickel pad, a chip, a solder silver bump, the adhesive film and a solder ball. The nickel pad is fixedly connected onto the substrate, and the solder silver bump is fixedly connected onto the chip; the solder silver bump is coincided with a central line of the nickel pad and connected with the central line of the nickel pad in soldering mode; and the adhesive film fills the gap between the substrate and the chip and surrounds the nickel pad and the solder silver bump. The manufacture process is conducted according to the following steps: pasting the adhesive film; installing the chip and reflow soldering; reducing thickness of the back of a wafer; and placing the ball, inspecting, packaging and putting in storage. By means of the technology, packaging cost is reduced, packaging reliability is improved, and process links are reduced.

The invention discloses an adhesive film feeding mechanism. The adhesive film feeding mechanism comprises a conveying module, a feeding module and a receiving module; the conveying module comprises a conveying belt and a control unit; the feeding module comprises an adhesive film support and a guide wheel set; the receiving module comprises an adhesive film separating structure and an adhesive film guide structure; and during feeding, an adhesive film is attached to the conveying belt and is driven through motion of the conveying belt to be fed, and through motion between the modules and design changes of allocation relations, the control complexity of the feeding mechanism is reduced. According to the adhesive film feeding mechanism, a guide wheel set can be used for extruding bubbles generated during adhesive film attaching out, a leveling wheel can be used in a matched manner to flatly attach the adhesive film to the conveying belt, and therefore the cutting quality of the adhesive film is maintained.

The invention relates to a single-chip package part with a wafer being thinned after bottom fillers cures and a manufacture process thereof. The package part is mainly composed of a substrate, a nickel gold soldering pad, a chip, a tin-silver salient point, bottom fillers and a solder ball, wherein the nickel gold soldering pad is fixedly connected on the substrate, the tin-silver salient point is fixedly connected on the chip, the tin-silver salient point coincides with the central line of the nickel gold soldering pad and is welded with the nickel gold soldering pad, the bottom fillers are filled in a gap between the substrate and the chip to surround the nickel gold soldering pad and the tin-silver salient point, and the tin-silver salient point and the nickel gold soldering pad are welded through soldering flux. The manufacture process comprises the following steps of bonding the chip, reflow soldering, cleaning with deionized water, filling, curing, thinning the wafer, reballing, checking, packing and storing. The manufacture process enables the package part to be thin in size, high in performance and can obviously reliability of the package part.

The invention discloses anti-warping glutinous rice glue and a preparation method thereof, and belongs to the technical field of building materials. Glutinous rice base glue is prepared by taking glutinous rice as a raw material for gelatinization, alpha-amylase is added to cut off starch molecular main chains, and then a part of alcohol hydroxyl groups on the starch molecular chains are oxidizedby substances such as hydrogen peroxide and the like, so that solubility of the glutinous rice glue is enhanced. According to the invention, palm oil and the like are taken as raw materials, vermiculite and diatomaceous earth are added at the same time, moisture of the glutinous rice glue is kept through water absorption, and bonding performance is improved. An amphiphilic moisturizing active agent is prepared by carrying out a reaction on coconut oil acyl chloride with phospholipid, and glacial acetic acid and the like are added for a reaction to form a stable glutinous rice glue system, so that warping possibility of wallpaper is reduced. The glutinous rice based glue is used for improving permeability of the glutinous rice glue, a grease additive is added for preventing dry shrinkage and cracking, and the amphiphilic moisturizing active agent is added to reduce warping of the wallpaper, so that usability of the glutinous rice rubber is improved. According to the invention, the problem that the wallpaper is warped due to the fact that a hardening phenomenon occurs easily after existing glutinous rice glue is used for construction is solved.

The invention discloses an MEMS structure comprising a substrate which comprises an outer ring body and a first inner ring body which is arranged in the outer ring body and spaced from the outer ringbody, wherein cavities are formed between the outer ring body and the first inner ring body and in the inner side of the first inner ring body; and a piezoelectric composite vibration layer formed above the substrate, and comprising a fixed end connected with the first inner ring body and a free end suspended above the cavity. By arranging one or more inner ring bodies, the length of a cantileverbeam from the fixed end to the free end is shortened, so that the warping probability of the diaphragm of the piezoelectric composite vibration layer is reduced. The sensitivity of a plurality of cantilever beam structures in the piezoelectric composite vibration layer is effectively improved.

The invention discloses a die cooling structure capable of reducing warpage deformation. The die cooling structure comprises a male die, a female die, a water tank and a mounting frame, the male die and the female die are clamped with each other to form a die core cavity; and the left side and the right side of the die core cavity are respectively provided with a heat dissipation cavity I and a heat dissipation cavity II, and a main pipeline I, four water return pipelines I and a plurality of branch pipelines I are arranged in the male die, wherein one end of each branch pipeline I is connected with the heat dissipation cavity I. Different from the cooling method in which multiple water pipes are distributed in the die in the conventional technical means, the heat dissipation cavity I is used to cool and dissipate heat. The water injection mode in the male die is to inject water into the heat dissipation cavity I through the plurality of branch pipelines I, so that the speed of the cold water entering the heat dissipation cavity I is synchronous. Different from the cooling mode of the heat absorption of the pipeline in the die of the conventional technical means, the warpage deformation possibility of the die core can be reduced through a uniform water injection mode.

A copper wire pay-off device disclosed by the present invention comprises a brush plate and a plurality of resin fine wires, a fixing hole is arranged in the middle part of the brush plate, and the plurality of resin fine wires extend outwards along the radial direction of the brush plate. A concentric and annular lower platen is adhered on the upper surface of the brush plate, the resin fine wires are covered by the lower platen locally, and the lower surface of the lower platen is equipped with an annular groove in which a bending segment is placed. According to the present invention, by utilizing the flexibility of the plurality of resin fine wires on the brush plate and extending outwards, a copper wire is contacted with the resin fine wires directly before breaking away from a drum, so that the operation amplitude of the copper wire is increased when the copper wire breaks away from the drum, the resin fine wires recover to the initial positions because of the own elastic deformation recovery effects after generating a certain swing upwards along with the copper wire, at the same time, the wear extent caused by the contact of the copper wire and the resin fine wires can be neglected, namely, the wear of the copper wire is reduced while the copper wire can break away from the drum conveniently and rapidly.

The application relates to an LCD electric detection test device, which comprises a base and a gland, the upper surface of the base is provided with an insulating cushion layer for placing an LCD product and a first conductive adhesive tape for abutting against a connecting terminal of the LCD product, the lower surface of the insulating cushion layer is provided with a supporting plate, and the supporting plate is slidably connected to the base. The sliding direction of the supporting plate and the height direction of the base are arranged in the same direction; and a positioning mechanism for positioning the supporting plate is arranged between the supporting plate and the base. The gland is connected to the upper portion of the base in a flip mode, a pressing strip is installed on the side, facing the base, of the gland, a second conductive adhesive tape is bonded to the side, facing the base, of the pressing strip, and when the gland is pressed on the base, the first conductive adhesive tape and the second conductive adhesive tape are attached to each other. The LCD electric detection test device can be suitable for front-mounted and back-mounted LCD products at the same time, the possibility of tilting of the LCD products during electric detection test is reduced, and then the compatibility of the LCD products and the accuracy of electric detection test results are improved.

The invention discloses a wire-drawing and unwinding structure, including a brush plate and a plurality of thin resin wires, a fixing hole is opened in the middle of the brush plate, and a plurality of thin resin wires extend outwards of the brush plate along the radial direction of the brush plate. The upper surface of the brush disc is bonded with a concentric and ring-shaped lower pressing plate, the lower pressing plate partially covers the thin resin lines, the lower surface of the lower pressing plate is provided with an annular groove, and the curved section is placed in the annular groove. The present invention utilizes the flexibility of a plurality of resin thin wires extending outward on the brush disc to make the copper wires directly contact with the resin thin wires before detaching from the reel, so that the running range of the copper wires when detached from the reel increases, The thin resin wire will return to its original position due to its own elastic deformation recovery after a certain swing upward with the copper wire. At the same time, the amount of wear caused by the contact between the copper wire and the thin resin wire is negligible, which is convenient for the copper wire. While quickly detaching from the drum, the wear of the copper wire is reduced.

The invention discloses a tab flattening device with simple and convenient operation for lithium ion battery production, which comprises a box body, wherein a buffer frame is arranged on the upper portion of an inner cavity of the box body, a pressing frame is embedded in the buffer frame, first transmission rollers are movably installed at the left end and the right end of the inner cavity of the pressing frame correspondingly, the surfaces of the two first transmission rollers are jointly sleeved with a lower pressing belt, lower pressing rollers are embedded in the lower pressing belt at equal intervals, a conveying belt is arranged below the lower pressing belt, supporting rollers are embedded in the middle of the conveying belt at equal intervals, and a sleeve is embedded in the top of the box body through a bearing. According to the invention, the lower pressing belt is used for extruding and flattening the whole tab so as to enable the whole tab to be stressed uniformly and not easy to damage, the probability that the edges of the tab tilt is reduced, the whole flattening effect on the tab is good, and the distance between the lower pressing belt and the conveying belt can be adjusted by rotating the handle, so that the pressure on the whole tab is adjusted, and the tab flattening effect is effectively improved.

The invention discloses an adjustment device capable of realizing wire drawing and unwinding of copper wires, including a brush plate and a plurality of thin resin wires, a fixing hole is opened in the middle of the brush plate, and a plurality of thin resin wires are drawn along the radial direction of the brush plate. The brush plate extends outside, and the upper surface of the brush plate is bonded with a concentric and annular lower pressure plate. The lower pressure plate covers part of the resin thin line. The lower surface of the lower pressure plate is provided with an annular groove. in the slot. The present invention utilizes the flexibility of a plurality of resin thin wires extending outward on the brush disc to make the copper wires directly contact with the resin thin wires before detaching from the reel, so that the running range of the copper wires when detached from the reel increases, The thin resin wire will return to its original position due to its own elastic deformation recovery after a certain swing upward with the copper wire. At the same time, the amount of wear caused by the contact between the copper wire and the thin resin wire is negligible, which is convenient for the copper wire. While quickly detaching from the drum, the wear of the copper wire is reduced.

The invention discloses a machining method for whole bamboo dense floors. Firstly, fresh bamboo sections are manufactured into flat plate bamboo chips after the procedures of chip cutting, inner segment removing, softening and flattening, the flat plate bamboo chips are planed through a pressuring planer, and then whole bamboo floor blanks are manufactured; then, after the whole bamboo floor blanks are subjected to pressure impregnation and glue drainage, the whole bamboo floor blanks are stacked in a steel solidification tank in order, and the steel solidification tank is fed into a prepress for pressurizing and densifying; and finally, the steel solidification tank in which the whole bamboo floor blanks are stacked is fed into a wood drying kiln for drying and solidifying, after the steel solidification tank is placed for 10-20 days at room temperature, the whole bamboo floor blanks are fed into a matcher and a double-end profiler for machining, and the finished whole bamboo dense floors are manufactured after the procedures of sanding and varnishing are conducted. Internal stress generated due to high-temperature softening in flattened whole bamboo floors can be eliminated, the dimensional stability of the whole bamboo floor products can be improved, the probability of occurrence of buckling deformation of the whole bamboo floor products can be reduced, and therefore wide market development prospects are achieved.

The present application discloses a method for manufacturing a MEMS structure, comprising: forming a piezoelectric composite vibration layer on the front surface of a substrate; etching the back surface of the substrate until reaching the piezoelectric composite vibration layer, so that the substrate includes an outer ring body and a support plate arranged in the outer ring body and connected to the outer ring body, wherein a cavity is formed between the support plate and the outer ring body; the piezoelectric composite vibration layer is divided by etching , the piezoelectric composite vibration layer includes a fixed end connected to the support plate and a free end suspended above the cavity. The manufacturing method of the MEMS structure provided by the application reduces the process difficulty and improves the performance of the MEMS structure.

The invention relates to the technical field of 3D printing equipment, in particular to a 3D printer with an edge warping prevention function. A switching assembly comprises a lifting part fixedly arranged on the inner bottom wall of a box body and a rotating assembly arranged on the lifting part; the lifting part is used for driving the rotating assembly to ascend and descend in the box body; the rotating assembly includes a rotating shaft, a driving part and two trays, wherein the lower end of the rotating shaft is rotationally connected to the lifting part, the driving part is fixedly arranged on the lifting part and used for driving the rotating shaft to rotate, and the two trays are fixedly arranged at the upper end of the rotating shaft; and a processor is electrically connected to a printing device, a glue brushing device, the lifting part and the driving part, so that the rotating shaft is driven to rotate through a control instruction of the processor so as to drive the two trays to be paused under the glue brushing device and the printing device respectively, and the tray brushed with glue through the glue brushing device rotates to the position under the printing device. The problems that an existing 3D printer is low in printing efficiency, a printing material falls on a tray and shrinks when cooled, and a printed sample is prone to edge warping are solved.

The present invention provides a double-sided pressure-sensitive adhesive sheet. The double-sided pressure-sensitive adhesive sheet of the present invention has a pressure-sensitive adhesive layer including a cross-linked structure formed by the reaction of a cross-linking agent and a cross-linkable polymer. The core material has an adhesive layer laminated on each main surface, wherein the adhesive layer has a residual stress ratio of less than 40%, and the crosslinking agent contains toluene diisocyanate. It is preferable to form the pressure-sensitive adhesive layer at a gel rate of 10% or more and 70% or less. With such a double-sided PSA sheet, even when the adherend has a highly curved surface, peeling is less likely to occur and the possibility of outgassing can be reduced.

The invention belongs to the related field of advanced manufacturing technology, and discloses a pre-heating cylinder body used for high-temperature laser area selective sintering. In the thickness direction of a cylinder body, the cylinder body comprises an anisotropy heat conduction layer, a ceramic unit temperature control element, a carbon fiber supporting pad, a ceramic heat insulation heat preservation plate and a heating power protection layer from inside to outside, and specific structures and arrangement manners of components are further subjected to optimized design. The invention further discloses a corresponding forming method. Through the method, the longitudinal heating area is selectively controlled, powder, with a certain thickness, to be fed only needs to be preheated to be within the sintered window range, lower mostly-stored powder is subjected to gradient preheating, the temperature is reduced layer by layer, distribution type uniform control over the temperature ofthe pre-heating cylinder body is achieved, and dissipation of redundant heat is reduced while the preheating efficiency is improved. In addition, 400 DEG C high-temperature preheating of the laser sintering temperature field can be effectively achieved, and the pre-heating cylinder body is particularly suitable for SLS machining forming application occasions of high-melting-point polymer like PEEK parts.

The present invention provides a fan-out wafer-level chip packaging structure and a packaging method, wherein the fan-out wafer-level chip packaging structure includes: a conductive layer, on which grooves for setting chips are formed; On the substrate; the insulating layer is arranged between the conductive layer and the substrate, and is used to fill the gap between the conductive layer and the substrate; the package is arranged on the upper surface of the conductive layer; the chip is packaged in the package, and the pad of the chip exposed outside the package; the conductive post is arranged in the package, one end is coupled with the conductive layer, and the other end is exposed outside the package; the conductive post is connected to the ground wire. By placing the chip in the groove on the conductive layer, and the conductive layer is connected to the ground wire through the conductive column, an electromagnetic shielding structure inside the fan-out wafer-level chip packaging structure can be formed, which can reduce the impact of the chip on the packaging structure. The possibility of electromagnetic wave interference of internal devices and external devices is less difficult to prepare and the production cost is lower.