53results about How to "Reduce the chance of warping" patented technology

The invention provides a making method of a substrate with a support. The making method comprises the following steps: forming the substrate, wherein the substrate comprises an effective zone for forming a device and an edge zone positioned at the periphery of the effective zone; forming a support plate in a shape corresponding to that of the edge zone of the substrate, wherein the support plate comprises a binding face matched with the substrate; binding and fixing the binding face of the support plate with the edge zone of the substrate. The making method has the benefits that the support plate is bonded with the substrate, so that the support plate has a function of reinforcing the edge of the substrate, and accordingly, can prevent the substrate from warping to a certain extent; the support plate and the substrate are bonded with one another and do not need to be disassembled. Compared with the mode of disassembling the bracket in the prior art, the making method can reduce the possibility that the substrate is damaged and broken.

The invention discloses a machining method for whole bamboo dense floors. Firstly, fresh bamboo sections are manufactured into flat plate bamboo chips after the procedures of chip cutting, inner segment removing, softening and flattening, the flat plate bamboo chips are planed through a pressuring planer, and then whole bamboo floor blanks are manufactured; then, after the whole bamboo floor blanks are subjected to pressure impregnation and glue drainage, the whole bamboo floor blanks are stacked in a steel solidification tank in order, and the steel solidification tank is fed into a prepress for pressurizing and densifying; and finally, the steel solidification tank in which the whole bamboo floor blanks are stacked is fed into a wood drying kiln for drying and solidifying, after the steel solidification tank is placed for 10-20 days at room temperature, the whole bamboo floor blanks are fed into a matcher and a double-end profiler for machining, and the finished whole bamboo dense floors are manufactured after the procedures of sanding and varnishing are conducted. Internal stress generated due to high-temperature softening in flattened whole bamboo floors can be eliminated, the dimensional stability of the whole bamboo floor products can be improved, the probability of occurrence of buckling deformation of the whole bamboo floor products can be reduced, and therefore wide market development prospects are achieved.

The present application discloses a method for manufacturing a MEMS structure, comprising: forming a piezoelectric composite vibration layer on the front surface of a substrate; etching the back surface of the substrate until reaching the piezoelectric composite vibration layer, so that the substrate includes an outer ring body and a support plate arranged in the outer ring body and connected to the outer ring body, wherein a cavity is formed between the support plate and the outer ring body; the piezoelectric composite vibration layer is divided by etching , the piezoelectric composite vibration layer includes a fixed end connected to the support plate and a free end suspended above the cavity. The manufacturing method of the MEMS structure provided by the application reduces the process difficulty and improves the performance of the MEMS structure.

The present invention provides a fan-out wafer-level chip packaging structure and a packaging method, wherein the fan-out wafer-level chip packaging structure includes: a conductive layer, on which grooves for setting chips are formed; On the substrate; the insulating layer is arranged between the conductive layer and the substrate, and is used to fill the gap between the conductive layer and the substrate; the package is arranged on the upper surface of the conductive layer; the chip is packaged in the package, and the pad of the chip exposed outside the package; the conductive post is arranged in the package, one end is coupled with the conductive layer, and the other end is exposed outside the package; the conductive post is connected to the ground wire. By placing the chip in the groove on the conductive layer, and the conductive layer is connected to the ground wire through the conductive column, an electromagnetic shielding structure inside the fan-out wafer-level chip packaging structure can be formed, which can reduce the impact of the chip on the packaging structure. The possibility of electromagnetic wave interference of internal devices and external devices is less difficult to prepare and the production cost is lower.