Single-chip package part with wafer thinned after bottom fillers cures and manufacture process thereof

Abstract

The invention relates to a single-chip package part with a wafer being thinned after bottom fillers cures and a manufacture process thereof. The package part is mainly composed of a substrate, a nickel gold soldering pad, a chip, a tin-silver salient point, bottom fillers and a solder ball, wherein the nickel gold soldering pad is fixedly connected on the substrate, the tin-silver salient point is fixedly connected on the chip, the tin-silver salient point coincides with the central line of the nickel gold soldering pad and is welded with the nickel gold soldering pad, the bottom fillers are filled in a gap between the substrate and the chip to surround the nickel gold soldering pad and the tin-silver salient point, and the tin-silver salient point and the nickel gold soldering pad are welded through soldering flux. The manufacture process comprises the following steps of bonding the chip, reflow soldering, cleaning with deionized water, filling, curing, thinning the wafer, reballing, checking, packing and storing. The manufacture process enables the package part to be thin in size, high in performance and can obviously reliability of the package part.

Description

[0001] technical field [0002] The invention belongs to the technical field of integrated circuit packaging, and in particular relates to a single-chip package with a wafer thinned after the underfill is solidified and a manufacturing process thereof. Background technique [0003] Flip Chip is not only a chip interconnection technology, but also an ideal chip bonding technology. As early as 30 years ago, IBM has developed and used this technology. However, it is not until recent years that Flip-Chip has become a commonly used packaging form in the field of high-end devices and high-density packaging. Today, the application range of Flip-Chip packaging technology is becoming wider and wider, and the packaging forms are becoming more diversified, so the requirements for Flip-Chip packaging technology are also increasing. At the same time, Flip-Chip also poses a series of new serious challenges to manufacturers, providing reliable support for packaging, assembly and testing ...

AI Technical Summary

Problems solved by technology

However, due to the limitations of traditional packaging in the past, the wafer can only be thinned to 200 μm, especially when the thickness is reduced to less than 100 μm, it is easy to warp, and the reliability of the package cannot be guaranteed.

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