Cleaning method of optical substrate for laser thin-film element

Abstract

The invention relates to a cleaning method of an optical substrate for a laser thin-film element. The cleaning method includes the specific methods: using a cotton swab dipped with acetone for wiping the optical substrate until the surface of the substrate is free of macroscopic contaminants under the irradiation of an incandescent lamp; placing the wiped substrate in alkaline solution of a first tank, and respectively performing ultrasonic cleaning for the substrate successively by different frequencies; placing the substrate in a second tank, and using deionized water for spraying; and placing the substrate in deionized water of a third tank, successively subjecting the substrate to ultrasonic with different frequencies for 3-6 minutes, observing the surface cleanliness of the substrate under the incandescent lamp, and after the surface of the substrate is free of macroscopic particles, placing the substrate in deionized water of a fourth tank for slow lifting under ultrasonic of 80KHz, and drying the lifted substrate by hot blowing so that the required product is obtained. A cleaning processing and surface detection are combined together, a wiping method, a chemical cleaning method and an ultrasonic cleaning method are combined for comprehensive application, so that high cleaning efficiency and optimal cleaning effect less in damage to the smooth surface of the substrate are achieved.

Description

technical field [0001] The invention relates to a cleaning method of an optical substrate for a laser thin-film element, in particular to a cleaning method for reducing the surface defect density of the substrate and increasing the laser damage threshold of the laser thin-film element through the process control of the whole process, which belongs to the field of optical technology. Background technique [0002] Laser film is a key component in high-power laser systems, and its performance largely determines the output performance of the laser. Laser film is also a weak link in high-power laser systems, and its damage threshold directly determines the strength of laser output and endangers the stable operation of high-power laser systems. Improving the performance of laser thin films and increasing the damage threshold of laser thin films has always been an important content in the field of laser and thin films. [0003] There are many factors that affect the final damage t...

AI Technical Summary

Problems solved by technology

Among them, the wiping method is more effective for large-scale particles above microns, but it is difficult to remove sub-micron particles; RCA cleaning belongs to chemical cleaning, which can reduce the adsorption force between particles and substrates, but if the concentration of chemical solutions is not properly controlled, it will cause Severe corrosion of the substrate leads to an increase in surface roughness; ultrasonic cleaning can efficiently remove particles of various sizes from micron to submicron on the surface of the substrate by selecting the frequency. However, when the ultrasonic frequency is selected improperly or the ultrasonic time is too long, concave Pits, pits, etc., causing physical damage to the substrate surface

It can be seen that the above three types of methods have their own advantages. However, for the cleaning of optical substrates, people usually optimize a specific process alone without linking these methods, and there is no effective cleaning process for each cleaning process in the cleaning process. Therefore, it is difficult to obtain an optimal cleaning process with high cleaning efficiency and minimal damage to the smooth surface of the substrate

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