Top emission OLED (Organic Light-Emitting Diode) and preparation method thereof
A luminescence and top-emission technology, applied in the direction of circuits, electrical components, electric solid devices, etc., can solve the problems of display device application hindrance, content cannot be seen clearly, etc., and achieve the effects of easy manufacturing process, reduced reflection, and simple operation
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Embodiment 1
[0055] The structure of the top emission organic electroluminescent diode in the present embodiment 1 is: PET / Ag / m-MTDATA / NPB / (FIrPic:CBP) / Alq 3 / LiF / (Ag / Al:Alq 3 / CsF / Ag).
[0056] The preparation process of the top emission organic electroluminescent diode is as follows:
[0057] The PET film substrate was placed in deionized water containing detergent for ultrasonic cleaning, and after cleaning, it was treated with isopropanol and acetone in ultrasonic for 20 minutes, and then dried with nitrogen.
[0058] In a vacuum evaporation system, Ag with a thickness of 18 nm was deposited on the surface of the PET film as an anode layer, and then the anode layer was treated with oxygen plasma for 2 minutes.
[0059] After the treatment, continue to vapor-deposit a hole injection layer m-MTDATA with a thickness of 30nm, a hole transport layer NPB with a thickness of 40nm, and a light-emitting layer FIrPic:CBP with a thickness of 20nm (wherein, FIrPic is the guest material) on the s...
Embodiment 2
[0062] The structure of the top-emitting organic electroluminescent diode in this embodiment 2 is: PC / Al / m-MTDATA / NPB / (FIrPic:CBP) / Alq 3 / LiF / (Al / Li:Bphen / LiF / Al).
[0063] The preparation process of the top emission organic electroluminescent diode is as follows:
[0064] The PC film substrate is placed in deionized water containing detergent for ultrasonic cleaning, and after cleaning, it is treated with isopropanol and acetone in ultrasonic for 20 minutes, and then blown dry with nitrogen.
[0065] In a vacuum evaporation system, Al with a thickness of 20 nm was deposited on the surface of the PC film as an anode layer, and then the anode layer was treated with oxygen plasma for 5 minutes.
[0066] After the treatment, continue to vapor-deposit a hole injection layer m-MTDATA with a thickness of 30nm, a hole transport layer NPB with a thickness of 40nm, and a light-emitting layer FIrPic:CBP with a thickness of 20nm (wherein, FIrPic is the guest material) on the surface of ...
Embodiment 3
[0069] The structure of the top emission organic electroluminescent diode of the present embodiment 3 is: PI / Ag / m-MTDATA / NPB / (FIrPic:CBP) / Alq 3 / LiF / (Al / Cs:TPBi / CsF / Al-Ag).
[0070] The preparation process of the top emission organic electroluminescent diode is as follows:
[0071] Put the PI film substrate in deionized water containing detergent for ultrasonic cleaning. After cleaning, it was treated with isopropanol and acetone in ultrasonic for 20 minutes, and then dried with nitrogen.
[0072] In a vacuum evaporation system, Ag with a thickness of 25 nm was deposited on the surface of the PI film as an anode layer, and then the anode layer was treated with oxygen plasma for 2 minutes.
[0073] After the treatment, continue to vapor-deposit a hole injection layer m-MTDATA with a thickness of 30nm, a hole transport layer NPB with a thickness of 40nm, and a light-emitting layer FIrPic:CBP with a thickness of 20nm (wherein, FIrPic is the guest material) on the surface of the ...
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