Heat dissipation substrate

Abstract

The invention discloses a heat dissipation base material which is composed of a head dissipation insulation polymeric layer, a first heat dissipation rubber layer, a second heat dissipation rubber layer and a metal layer. The heat dissipation insulation polymeric layer is used for achieving a high breakdown resistant voltage effect. The heat dissipation characteristics of the three layers of materials, namely, the heat dissipation insulation polymeric layer, the first heat dissipation rubber layer and the second heat dissipation rubber layer are used for achieving the high heat dissipation effect of the entire base material. The heat dissipation base material is suitable for light box pieces which have the requirements higher than common flexible printed circuit (FPC) materials. Half-buried holes are convenient to form when the heat dissipation base material is manufactured, and production efficiency and yield can be better improved.

Description

technical field [0001] The invention relates to a flexible copper foil high thermal conductivity substrate used for heat dissipation products such as LEDs and FPCs. Background technique [0002] With the rising awareness of global environmental protection, energy saving has become the current trend. The LED industry is one of the most watched industries in recent years. So far, LED products have the advantages of energy saving, power saving, high efficiency, fast response time, long life cycle, mercury-free, and environmental protection benefits. However, usually only about 20% of the input power of high-power LED products can be converted into light, and the remaining 80% of the electrical energy is converted into heat energy. [0003] Generally speaking, if the heat energy generated when the LED emits light cannot be exported, the junction temperature of the LED will be too high, which will affect the product life cycle, luminous efficiency and stability. [0004] Becau...

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Problems solved by technology

[0003] Generally speaking, if the heat energy generated by the LED light cannot be exported, the temperature of the LED junction will be too high, which will affect the product life cycle, luminous efficiency and stability

[0004] Because traditional heat dissipation materials need to consider the insulation properties to achieve the effect of breakdown voltage, the product thickness needs to be 60um to 120um to meet the requirements, so the total thickness of the product will be large, and the heat dissipation effect is not ideal. The increase leads to an increase in cost and difficulty in production; and in order to achieve the corresponding heat conduction effect, it is necessary to add a large amount of heat dissipation particles to the glue.

If the heat dissipation model of TPI (thermoplastic polyimide) + heat dissipation powder is used, although the thickness of the product can be reduced and the requirements of insulation properties can be met, but because the processing of TPI requires high temperature operation (operating temperature is greater than 350 ° C), so processing The cost is very high, and it cannot be mass-produced effectively

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