Method for improving overlength high frequency circuit board hole site working accuracy

A high-frequency circuit board and processing precision technology, which is applied in printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems of hole position precision offset change, drilling precision misalignment, sheet stretching, etc., and achieve stable thermal expansion coefficient , improve accuracy, and remove moisture

Active Publication Date: 2013-05-01
SHENZHEN BOMIN ELECTRONICS
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Problems solved by technology

[0009] Therefore, the object of the present invention is to provide a method for improving the machining accuracy of ultra-long and high-frequency circuit board holes, so as to solve the defects of scattered positioning holes and fool-proof design during the processing of ultra-long and high-frequency circuits. Lead to the problem of drilling accuracy dislocation and offset in the production process
[0010] The purpose of the present invention is also to provide a method for improving the machining accuracy of ultra-long and high-frequency circuit board holes, so as to solve the problem of being affected by external forces when the copper surf

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  • Method for improving overlength high frequency circuit board hole site working accuracy
  • Method for improving overlength high frequency circuit board hole site working accuracy
  • Method for improving overlength high frequency circuit board hole site working accuracy

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Embodiment Construction

[0035] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0036] The present invention provides a method for improving the machining accuracy of ultra-long and high-frequency circuit board holes, which is mainly used to solve the problem of poor hole position accuracy during the processing of ultra-long and high-frequency circuit boards with a length exceeding 1000MM. question.

[0037] See Figure 7 as shown, Figure 7 It is a process flow chart of the method for improving the machining accuracy of ultra-long and high-frequency circuit board holes in the present invention. Wherein the present invention improves the method for hole position processing ...

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Abstract

The invention discloses a method for improving overlength high frequency circuit board hole site working accuracy. Through an interactive design of subsection drill holes and locating holes, the continuity and the consistency of a front section of drill holes and a rear section of drill holes are ensured, and the problems of dislocation, offset and the like are solved; an original mechanical plate grinding method is replaced with a chemical microetching method, so that the problem that the hole site accuracy is reduced caused by tensile deformation of panels is eliminated; and through baking before processing a circuit board and a finished product is delivered, so that the humidity in the board is effectively removed, the coefficient of thermal expansion of the panels is stabilized, and the problem of accuracy variation caused by deformation or tortuosity of the panels is solved. According to the method for improving overlength high frequency circuit board hole site working accuracy, the drilling accuracy of the overlength high frequency circuit board is effectively improved, the problems of disability in assembly, and severe signal interference caused by severe hole shift in an earlier stage are solved, the percent of pass of the overlength high frequency circuit board is improved, meanwhile, the product quality of enterprises is promoted, and the scrapping of products is reduced.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board production, and specifically relates to a method for improving the machining accuracy of hole positions of ultra-long and high-frequency circuit boards. Background technique [0002] With the rapid development of wireless network and satellite communication technology, information products and electronic equipment are gradually becoming high-frequency, and the development of a new generation of information electronic products requires high-frequency circuit boards, such as satellite systems, mobile phone receiving base stations and other communication products must use High frequency circuit board. [0003] With the widespread use of 3G communication technology and the expansion of 4G communication technology pilots, higher requirements are put forward for the use of high-frequency circuit boards, so ultra-long high-frequency circuit boards are gradually being widely used. Ultra-lon...

Claims

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Application Information

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IPC IPC(8): H05K3/00
Inventor 王强陆景富曹俊杰涂祥运
Owner SHENZHEN BOMIN ELECTRONICS
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