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Moisture-curing polyurethane hot-melt adhesive for manufacturing of composite boards

A hot-melt adhesive and polyurethane technology, used in the field of moisture-curing polyurethane hot-melt adhesives and hot-melt adhesive compositions, can solve problems such as poor adhesion performance and poor adhesiveness of adhesives, and achieve non-cracking, excellent adhesion performance, strong adhesion, etc. The effect of bond strength

Inactive Publication Date: 2013-05-08
HENAN ACADEMY OF SCI CHEM RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the poor adhesion of the adhesives used in the existing composite boards, especially the poor bonding performance between metal plates and non-metal plates, the present invention provides a method that can improve and improve the bonding between metal plates and non-metal plates. Strong Moisture Curing Polyurethane Hot Melt Adhesive

Method used

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Examples

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Embodiment 1

[0029] 320g of polypropylene glycol with a weight average molecular weight (MW) of 1,000, 460g of polypropylene glycol with a weight average molecular weight (MW) of 2,000, and 420g of Acryloid ? Mix B-99N (intrinsic viscosity about 0.078) evenly, heat to 150°C to melt and stir vigorously until B-99N is fully dissolved in polyol, then add the mixture to 520g Dynacoll ? 7360 and 100g Dynacoll ?In the double planetary mixer of 7130 polyester polyol, stir at 115°C for 30min in vacuum, then add 260g of 4,4'-diphenylmethane diisocyanate (MDI), and stir at 110°C~120°C under vacuum One hour, until the NCO% content reaches the theoretical value, it is packed into a container and sealed for use.

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PUM

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Abstract

The invention discloses a moisture-curing polyurethane hot-melt adhesive for manufacturing of composite boards, and belongs to the field of adhesives. The adhesive is prepared from the following raw materials: (a) a polyurethane prepolymer prepared through polymerization of isocyanate and polyhydric alcohols and (b) an acrylate polymer with a characteristic viscosity lower than 0.1. The adhesive has excellent bonding properties, is applicable to bonding of metallic and nonmetallic materials, and can be used for preparing high-performance metallic-nonmetallic composite boards.

Description

technical field [0001] The invention relates to a hot-melt adhesive composition, in particular to a moisture-curing polyurethane hot-melt adhesive, which belongs to the field of adhesives. Background technique [0002] Composite panels are usually pressed by metal or non-metal plates. Metal plates are usually the surface material, and non-metal plates such as plywood, cardboard, plastic board, etc. are usually the inner or inner layer materials. Sometimes honeycomb aluminum is also used for the inner layer. Material. Composite panels are widely used in construction, partition walls, furniture, transportation and other fields. The different materials of the composite board are bonded by adhesives. However, due to the continuous changes in the ambient temperature and humidity, and the poor adhesion of the adhesive itself to the metal surface, most adhesives are not suitable for metal materials on the surface. Composite board. An effective way to improve the adhesion of the ...

Claims

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Application Information

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IPC IPC(8): C09J175/08C09J175/06C09J175/04
Inventor 王金良周晓楠王建莉邢艳君王金涛沈政
Owner HENAN ACADEMY OF SCI CHEM RES INST CO LTD
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