Preparation method of copper-clad plate

A copper clad laminate and copper foil technology, applied in chemical instruments and methods, layered products, lamination devices, etc., can solve problems such as resin void defects, difficult industrial production applications, and inability to apply industrial production, etc., to improve thickness uniformity and consistency, the preparation method is simple and easy, and the effect of improving the problem of thin thickness
CN103101280AActive Publication Date: 2013-05-15SHENGYI TECH SUZHOU
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Applications(China)
Current Assignee / Owner
SHENGYI TECH SUZHOU
Publication Date
2013-05-15

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Abstract

The invention discloses a preparation method of a copper-clad plate, which comprises the following steps: (1) taking at least one prepreg, and stacking copper foils on the single side or double sides of the prepreg so as to obtain prepreg combinations; (2) taking at least one set of the prepreg combination, and placing the at least one set of the prepreg combination between upper and lower heating plates of a laminating machine to carry out laminated pressing; (3) in the stage of glue solution melting in the process of laminating, heating the periphery of the prepreg, so that a glue solution at the periphery of the prepreg achieves a high elastic state prior to a glue solution in the middle of the prepreg, wherein the relative curing degree of the glue solution in the high elastic state is over 60%; and (4) carrying out conventional laminating operation, so that the copper-clad plate can be obtained. According to the invention, a novel copper-clad plate preparation method is developed, so that the glue flowing problem in the process of laminating is prevented, and the problem that the thicknesses of four edges of the copper-clad plate are thin is effectively improved, thereby significantly improving the thickness uniformity and consistency of each part of the plate.
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Description

technical field

[0001] The invention relates to a method for preparing a copper-clad laminate, which belongs to the technical field of electronic materials. Background technique

[0002] Copper Clad Laminate (Copper Clad Laminate, full name copper clad laminate, English abbreviation CCL), is made of wood pulp paper or glass fiber cloth as a reinforcing material, impregnated with resin, covered with copper foil on one or both sides, and hot pressed into a product. Copper-clad laminates are the basic materials of the electronics industry and are mainly used for processing and manufacturing printed circuit boards (PCBs).

[0003] With the development of "light", "small", "thin" and "fast" terminal electronic products, circuit boards continue to develop in the direction of denser lines and thinner layers, so the impedance characteristics of transmission lines and Reliability, component assembly and processing accuracy put forward more stringent control requirements, so the req...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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