High-thermal-conductivity composite material and preparation method

A technology of composite materials and heat-conducting materials, which is applied in the field of heat-transfer materials and preparations, can solve problems such as heat source temperature rise, aging, and easy deformation of silica gel, and achieve the effects of expanding application range, high mechanical strength, and simple process

Inactive Publication Date: 2013-05-22
先进储能材料国家工程研究中心有限责任公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Contact thermal resistance will make the heat conduction channel unsmooth, causing heat accumulation on the contact surface, and the heat generated by the heat source cannot be quickly and effectively conducted to the surface of the radiator, so that the temperature of the heat source rises faster, and in the face of thermal shock. overheating crash
At present, in order to improve the heat transfer coefficient of thermally conductive silica gel, additive

Method used

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  • High-thermal-conductivity composite material and preparation method

Examples

Experimental program
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Effect test

Embodiment 1

[0014] A method for preparing a high thermal conductivity composite material, the schematic diagram of the process figure 1 shown. First, the porous copper 1 with a three-dimensional network formed by the interconnection of polyhedral cells is put into the container, and after vacuuming, the thermal conductive silicone grease 2 is injected into the container to completely fill the polyhedral cells of porous metal copper 4 and apply 10Mpa Pressure, and then vulcanization - after curing treatment, such as figure 2 The high thermal conductivity compound shown in 3.

[0015] The high thermal conductivity composite material 3 prepared by the above method, the composite material structure is as follows figure 2 shown. The material has a three-dimensional network formed by interconnecting polyhedral cells. The polyhedral cells 4 are filled with thermally conductive silica gel, and the remaining positions 5 are still metal copper, that is, only the pores of the original porous c...

Embodiment 2

[0017] The high thermal conductivity composite material is basically the same as that of Embodiment 1, but the porous metal material is porous nickel, and the pores are filled with thermal conductive rubber.

Embodiment 3

[0019] The high thermal conductivity composite material is basically the same as that of Embodiment 1, but the porous metal material is a porous nickel-copper alloy, and the pores are filled with thermal conductive silica gel.

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Abstract

The invention provides a high-thermal-conductivity composite material and a preparation method, wherein the composite material is in the shape of a three-dimensional network formed by mutually connecting polyhedral cells, the frames of the polyhedral cells are made from metal, and macromolecular thermal-conductive materials are fully filled in the polyhedral cells. The preparation method comprises the following steps of: placing porous metal materials in a container at first, vacuumizing and then injecting macromolecular thermal-conductive material precursors until pore spaces are fully filled; and then applying a certain pressure, performing vulcanizing-curing treatment, and then obtaining the needed composite material. The material provided by the invention is high in mechanical strength while being good in thermal conductivity; and the preparation method is simple in process, easy to control, low in energy consumption, and low in cost.

Description

technical field [0001] The invention relates to a heat transfer material and a preparation method, in particular to a high thermal conductivity composite material and a preparation method. Background technique [0002] In the heat dissipation of components, heat-conducting materials are mostly made of heat-conducting silica gel sheets. The main purpose is to reduce the contact thermal resistance between the surface of the heat source and the contact surface of the heat-dissipating device. Contact thermal resistance will make the heat conduction channel unsmooth, causing heat accumulation on the contact surface, and the heat generated by the heat source cannot be quickly and effectively conducted to the surface of the radiator, so that the temperature of the heat source rises faster, and in the face of thermal shock. Overheating crash. At present, in order to improve the heat transfer coefficient of thermally conductive silica gel, additives such as aluminum powder and silve...

Claims

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Application Information

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IPC IPC(8): C09K5/14
Inventor 张洪涛蒋素斌唐文进洪志刚石建珍
Owner 先进储能材料国家工程研究中心有限责任公司
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