Micro-channel cold-drawn plate designing method for active phase-control array antennas

Abstract

The invention discloses a micro-channel cold-drawn plate designing method for active phase-control array antennas. The micro-channel cold-drawn plate designing method includes: 1) determining a geometric model of an active phase-control array antenna; 2) determining outline size of a micro-channel cold-drawn plate of the active phase-control array antenna; 3) calculating temperature distribution of an array surface of the active phase-control array antenna; and 4) judging whether the design requirements are met or not. The micro-channel cold-drawn plate designing method provides an antenna heat insulation scheme by means of the micro-channel cold-drawn plate so as to guarantee efficient working and high performance of the antenna. Taking high width ratio alpha, width W, fluid inlet speed v and fluid inlet temperature T into consideration, temperature distribution under different parameters is obtained by modeling, and parameters are finally determined. Compared with the conventional methods depending on experience design, the micro-channel cold-drawn plate designing method can supply the optimum design scheme, the requirements can be met at one step, and design period is shortened. By calculating temperature distribution of the array surface, whether the design can meet the temperature requirements or not can be judged, parameters and runner layouts can be modified according to temperature distribution so as to meet the requirements, and the micro-channel cold-drawn plate designing method has significance for engineering.

Description

technical field [0001] The invention relates to the technical field of antennas, in particular to a microchannel cold plate design method for active phased array antennas. Background technique [0002] With the rapid development of electronic technology, miniaturized, highly integrated, and high-power electronic devices are widely used, and the assembly density of radar systems is getting higher and higher, resulting in a sharp increase in the heat flux of electronic components, and the problem of high heat dissipation has become increasingly prominent. With the continuous development of microelectronics technology, high-density high-power chips will be widely used in active phased array radar T / R components, and these highly integrated high-performance devices are rapidly increasing with the operating frequency It also makes its power density rise sharply, and the heat generation of some chips has exceeded 100W / cm 2 , if the heat generated by these devices cannot be taken ...

AI Technical Summary

Problems solved by technology

However, the air-cooled method has two disadvantages: one is that the interface design between the overall system and the sub-system

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