Adhesive for gluing piezoelectric ceramic buzzing slice and preparation method

A piezoelectric ceramics and buzzer technology, which is applied in the field of adhesives and preparation for piezoelectric ceramic buzzer sheets, can solve the problems of inability to withstand the impact of high temperature of 150°C, and achieves good thixotropy, good fluidity, and automation. production effect

Active Publication Date: 2013-05-29
NINGBO KEPO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The development direction of modern electronic components is miniaturization and integration. Their main feature is chip type, which is convenient for installation and automatic production. Buzzers and alarms are installed by wave soldering, which requires buzzers , the alarm should withstand the temperature shock of 150°C, as its main component, the piezoelectric ceramic buzzer should also be able to withstand the t

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] The mass ratio of each component of the adhesive for gluing piezoelectric ceramic buzzer pieces provided in this example is:

[0025] EPE modified epoxy resin: 83 parts;

[0026] 2-ethyl-4-methylimidazole: 5 parts;

[0027] Low molecular weight polyamide: 5 parts;

[0028] KH-550: 1.8 parts;

[0029] KH-560: 2.2 parts;

[0030] Nitrile rubber: 3 parts;

[0031] Wherein the mass proportioning of each component of EPE modified epoxy resin is:

[0032] E-51 epoxy resin: 20 parts;

[0033] E-42 epoxy resin: 45 parts;

[0034] Polyol glycidyl ether: 35 parts.

[0035] At the same time, this embodiment also provides the preparation method of the adhesive for gluing the above-mentioned piezoelectric ceramic buzzer sheet, and its specific steps are as follows:

[0036] a), E-51 epoxy resin, E-42 epoxy resin and polyol glycidyl ether were weighed according to the proportion, poured into the reaction kettle, and reacted at 60°C for 24 hours to obtain EPE modified epoxy re...

Embodiment 2

[0040] The general structure of the adhesive for gluing piezoelectric ceramic buzzer pieces provided in this example is consistent with that of Example 1, but the mass ratio of each component of the adhesive for gluing piezoelectric ceramic buzzer pieces in this example is:

[0041] EPE modified epoxy resin: 82 parts;

[0042] 2-ethyl-4-methylimidazole: 8.5 parts;

[0043] Low molecular weight polyamide: 2.5 parts;

[0044] KH-550: 1.2 parts;

[0045] KH-560: 2.6 parts;

[0046] Nitrile rubber: 3.2 parts.

[0047] Wherein the mass proportioning of each component of EPE modified epoxy resin is:

[0048] E-51 epoxy resin: 20 parts;

[0049] E-42 epoxy resin: 45 parts;

[0050] Polyol glycidyl ether: 35 parts.

[0051] At the same time, this embodiment also provides the preparation method of the adhesive for gluing the above-mentioned piezoelectric ceramic buzzer sheet, and its specific steps are as follows:

[0052] a), E-51 epoxy resin, E-42 epoxy resin and polyol glyci...

Embodiment 3

[0056] The general structure of the adhesive for gluing piezoelectric ceramic buzzer pieces provided in this example is consistent with that of Example 1, but the mass ratio of each component of the adhesive for gluing piezoelectric ceramic buzzer pieces in this example is:

[0057] EPE modified epoxy resin: 81 parts;

[0058] 2-ethyl-4-methylimidazole: 5 parts;

[0059] Low molecular weight polyamide: 5 parts;

[0060] KH-550: 1.5 parts;

[0061] KH-560: 2.5 parts;

[0062] Nitrile rubber: 5 parts.

[0063] Wherein the mass proportioning of each component of EPE modified epoxy resin is:

[0064] E-51 epoxy resin: 20 parts;

[0065] E-42 epoxy resin: 45 parts;

[0066] Polyol glycidyl ether: 35 parts.

[0067] At the same time, this embodiment also provides the preparation method of the adhesive for gluing the above-mentioned piezoelectric ceramic buzzer sheet, and its specific steps are as follows:

[0068]a), E-51 epoxy resin, E-42 epoxy resin and polyol glycidyl eth...

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PUM

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Abstract

The invention discloses the production technology of a piezoelectric ceramic buzzing slice, and particularly discloses an adhesive for gluing the piezoelectric ceramic buzzing slice and a preparation method. The adhesive comprises the following components in parts by mass: 79 to 83 parts of EPE (Expand Aple Poly Ephylene) modified epoxy resin, 5 to 8.5 parts of 2-ethyl-4-methylimidazole, 2.5 to 5 parts of low-molecular polyamide, 1.2 to 1.8 parts of KH-550, 2.1 to 2.6 parts of KH-560 and 3 to 5 parts of nitrile rubber buna, wherein the EPE modified epoxy resin comprises the following components in parts by mass: 20 parts of epoxy resin E-51, 45 parts of epoxy resin E-42 and 35 parts of polyol glycidyl ethers. According to the adhesive, the technical defect that the existing adhesive for gluing the piezoelectric ceramic buzzing slice cannot resist the impact at the high temperature of 150 DEG C is solved. The adhesive disclosed by the invention has the advantages of capability of resisting the wave peak welding impact at the high temperature of 150 DEG C, and long service life and the like. The adhesive can realize the automatic production of the piezoelectric ceramic buzzing slice, and is safe and reliable.

Description

technical field [0001] The invention relates to a production technology of a piezoelectric ceramic buzzer, in particular to an adhesive for gluing a piezoelectric ceramic buzzer and a preparation method thereof. Background technique [0002] Piezoelectric ceramic buzzers are the main components used in buzzers and alarms, and buzzers and alarms are widely used in automobiles, household appliances, digital communications and security products. Due to the demand for these products More and more, the output of automobiles, air conditioners, refrigerators, electric water heaters, digital cameras, notebook computers, mobile phones, security alarms and other products are growing at a relatively fast rate, making domestic manufacturers optimistic about its development prospects . [0003] The development direction of modern electronic components is miniaturization and integration. Their main feature is chip type, which is convenient for installation and automatic production. Buzze...

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J11/06C09J11/08
Inventor 徐锦生
Owner NINGBO KEPO ELECTRONICS
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