A trench Schottky semiconductor device with multiple insulating layer isolation and its preparation method

A semiconductor and insulating layer technology, which is applied in the field of trench Schottky semiconductor devices, can solve the problems of multiple times, high on-resistance and reverse leakage current characteristics, so as to increase the doping concentration, reduce the forward conduction resistance, Effect of Improving Reverse Voltage Blocking Characteristics
CN103137710BActive Publication Date: 2016-08-03SEMICON MFG ELECTRONICS (SHAOXING) CORP

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SEMICON MFG ELECTRONICS (SHAOXING) CORP
Publication Date
2016-08-03

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention discloses a trench Schottky semiconductor device with various insulating layer isolation. Through various insulating layer structures, the electric field intensity distribution of drift regions is changed, and inverse voltage blocking properties of apparatuses are improved. The invention further provides a preparation method capable of achieving two-time photolithography processes to manufacture apparatuses.
Need to check novelty before this filing date? Find Prior Art

Description

Technical field

[0001] The invention relates to a trench Schottky semiconductor device with a variety of insulating layer isolations, and the invention also relates to a method for preparing a trench Schottky semiconductor device with a variety of insulating layer isolations. Background technique

[0002] Power semiconductor devices are widely used in power management and power applications. Especially semiconductor devices involving trench structures have become an important trend in device development. Schottky devices have the advantages of low forward turn-on voltage and fast turn-on and turn-off speed. At the same time, Schottky devices also have the disadvantages of large reverse leakage current and cannot be used in high-voltage environments.

[0003] Schottky diodes can be manufactured through a variety of different layout techniques, the most commonly used planar layout. A typical trench layout is shown in BJBaliga's Patent No. 5612567. The traditional trench-type Schott...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More