Moving field vacuum coating magnetron sputtering source

Abstract

The invention discloses a moving field vacuum coating magnetron sputtering source which comprises a target base plate, a platy target welded or fixed on the front of the target base plate by a pressure ring, a shielding ring, a magnetic steel base plate and inner magnetic steel and outer magnetic steel mounted on the magnetic steel base plate. An improvement is as follows: the diameter of the magnetic steel base plate is greater than the radius of the target and less than the diameter of the target; the axis of the magnetic steel base plate deviates from the axis of the target base plate; the magnetic steel base plate is fixed on a side surface of a spur gear; a gear ring meshed with the spur gear is mounted on a rack of a coating machine; a motor located on the rear side of the spur gear is mounted on the rack; a crank handle is fixed on a power output shaft of the motor; a gear shaft is mounted on the crank handle; and the power output shaft of the motor and the gear ring are coaxially arranged with the target base plate. The moving field vacuum coating magnetron sputtering source disclosed by the invention has the positive effects that a toroidal magnetic field with revolution and autorotation is obtained and used for scanning each position of the target so that a larger area of the target is uniformly sputtered and etched. The utilization rate of the target is high, and the coating is uniform.

Description

technical field [0001] The invention belongs to the field of metallurgy, and in particular relates to a vacuum magnetron sputtering method for depositing and coating equipment on the surface of a material. Background technique [0002] With the development of science and technology, more and more products and devices are prepared by vacuum deposition, especially the magnetron sputtering technology is widely used for its high output and good film quality. At present, magnetron sputtering technology is widely used in high-tech fields such as integrated circuits, liquid crystal displays, thin-film solar cells and LEDs. The magnetron sputtering source is its key component. Circular magnetron sputtering sources are often used in scientific research experiments and the production of small devices. Because the sputtering target is relatively expensive, the small magnetron sputtering source brings another technical problem: how to make the sputtering etching track of the target on...

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Problems solved by technology

[0006] The purpose of the present invention is to provide a dynamic magnetic field vacuum coating magnetron sputtering source, which is used to produce products or devices with vacuum deposited layers, and overcomes the problem of target material and magnet in the prior art due to the relatively fixed positions of the target material. The technical problems of low utilization rate and poor sputtering uniformity, and the complex cost of equipment in the technical solution proposed to eliminate the aforementioned shortcomings are difficult to implement and low in efficiency, and are not suitable for small magnetron sputtering sources. question

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