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Aluminum oxide film containing ta

A kind of aluminum oxide, thin film technology, used in ion implantation plating, coating, metal material coating process and other directions

Inactive Publication Date: 2015-09-30
KOBE STEEL LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

No technology has been disclosed so far to produce a film having the same characteristics as an aluminum oxide film with high productivity by a preferred sputtering method

Method used

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  • Aluminum oxide film containing ta
  • Aluminum oxide film containing ta
  • Aluminum oxide film containing ta

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0080] In this example, the Ta content of the sputtering target was changed for comparative study in order to examine the effect of increasing the film formation rate by the addition of Ta and the influence of the addition of Ta on the wet etching property. According to the following method, a Ta-containing alumina thin film containing the same amount of Ta as the Ta content of the sputtering target used was obtained.

[0081] Specifically, various sputtering targets [Al—Ta sputtering target (remainder: unavoidable impurities)] shown in Table 1 were manufactured by the following method.

[0082] First, a Ta-containing Al alloy preform was obtained under the following spray foaming conditions.

[0083] (spray foaming conditions)

[0084] Melting temperature: 1300°C

[0085] Atomizing gas: nitrogen

[0086] Gas / Metal Ratio: 7Nm 3 / kg

[0087] Spray distance: 1050mm

[0088] Gas atomization outlet angle: 1°

[0089] Collector Angle: 35°

[0090] Next, the obtained preform...

Embodiment 2

[0124] In this example, the oxygen flow rate ratio during sputtering was changed, and the improvement effect of the film formation rate by the addition of Ta was compared and examined.

[0125] Specifically, an Al-1.5% Ta sputtering target (remainder: unavoidable impurities) and a pure Al sputtering target containing 1.5 atomic % of Ta were produced in the same manner as in Example 1 above. Next, the oxygen flow rate ratio [the ratio of the oxygen flow rate (sccm) to the total flow rate (sccm) of Ar gas and oxygen gas) was changed in the range of 0 to 0.6 in the manner shown in Table 2, and the DC magnetron was performed simultaneously. Except sputtering to make the film thickness about 600 nm, each thin film was formed in the same manner as in Example 1 above, and the average film formation rate and film formation rate ratio were calculated in the same manner as in Example 1 above. Also in this example, a Ta-containing alumina thin film containing Ta in the same amount as the...

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Abstract

The invention provides a film used as an alumina substituting film and has the characteristics of high film formation speed and excellent production rate. The alumina film containing Ta is characterized by containing Ta and is formed through a sputtering method.

Description

technical field [0001] The present invention relates to an aluminum oxide thin film containing Ta. The Ta-containing alumina thin film of the present invention can not only directly maintain the characteristics inherent in alumina which are excellent in electrical insulation and gas barrier properties such as oxygen and water vapor, but also can be formed into a film with high productivity preferably by sputtering. , so it is useful as a substitute film for alumina. [0002] Therefore, the thin film of the present invention can be suitably used in various technical fields utilizing the above-mentioned characteristics of alumina. Specifically, for example, an insulating film (including a protective film, etc.) or a gas barrier film used in a display device, a magnetic recording device, a photovoltaic device, a semiconductor element, etc.; an insulating film of a magnetic head mounted on a magnetic recording device (including spacers, protective films, etc.) or gas barrier fil...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/08C23C14/34
CPCC22C21/00C23C14/34H01L29/786
Inventor 前田刚彰奥野博行
Owner KOBE STEEL LTD