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A film capacitor with a composite substrate

A technology of film capacitors and composite substrates, which is applied in the direction of film/thick film capacitors, laminated capacitors, fixed capacitor parts, etc., can solve the problem of increasing leakage current, defects in the combination of film capacitors and printed circuit boards, and affecting film capacitors. Quality and other issues

Active Publication Date: 2016-02-17
LIYANG HUAJING ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the nickel substrate contains undesired impurities, or its purity is insufficient, it will limit the increase in the capacitance of the film capacitor, and may increase its leakage current, thereby affecting the quality of the film capacitor
[0004] Moreover, film capacitors are generally combined on printed circuit boards by embedding, and the circuit patterns of existing printed circuit boards are generally made of metal copper. Therefore, there are still defects in the combination of existing nickel substrate film capacitors and printed circuit boards.

Method used

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  • A film capacitor with a composite substrate

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Embodiment 1

[0014] see figure 1 , a film capacitor with a composite substrate has a composite substrate, a dielectric layer, and an electrode layer from bottom to top, wherein the composite substrate has a double-layer structure, and the double-layer structure includes a copper substrate and nickel containing trace impurities formed on the copper substrate. Substrate;

[0015] Wherein, the copper substrate is formed by using high-purity pure copper, and its purity is 99.999%;

[0016] Wherein, the nickel substrate has the following material in proportion by weight percentage: the content of nickel is greater than or equal to 99.98% by weight. The remaining 0.02% by weight is various impurities. The various impurities include: 0.0005-0.0008% by weight of manganese, 0.005-0.008% by weight of aluminum, 0.001-0.002% by weight of silver, 0.0005-0.001% by weight of chromium, 0.004-0.006% by weight of iron, 0.0005-0.0012 % by weight of silicon and 0.001-0.002% by weight of antimony and 0.001-...

Embodiment 2

[0033] see figure 1 , another example of manufacturing the film capacitor having the composite substrate of the present invention is as follows.

[0034] see figure 1 , the manufacturing method of the film capacitor with composite substrate comprises the steps in turn:

[0035] (1) Prepare raw materials with the following ratio: nickel greater than or equal to 99.98% by weight. The remaining 0.02% by weight is various impurities. The various impurities include: 0.0005-0.0008% by weight of manganese, 0.005-0.008% by weight of aluminum, 0.001-0.002% by weight of silver, 0.0005-0.001% by weight of chromium, 0.004-0.006% by weight of iron, 0.0005-0.0012 % by weight of silicon and 0.001-0.002% by weight of antimony and 0.001-0.002% by weight of tantalum;

[0036] (2) Rolling for the first time: after melting the above-mentioned raw materials, rolling them for the first time, the nickel substrate obtained by the first rolling is in the shape of a foil, and its thickness is 4 mm;...

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Abstract

The invention discloses a thin film capacitor with a composite substrate. The thin film capacitor comprises the composite substrate, a dielectric layer and an electrode layer from bottom to top. The composite substrate is of a double-layer structure. The double-layer structure comprises a copper substrate and a nickel substrate which contains trace impurity and formed on the copper substrate.

Description

technical field [0001] The invention belongs to the field of film capacitors, in particular to a film capacitor with a composite substrate. Background technique [0002] In existing film capacitors, higher requirements are placed on the capacitance of the capacitor. In the prior art, a film capacitor generally includes a substrate, a dielectric layer and an electrode layer. The microstructure of the dielectric layer is a key factor in determining the performance of the capacitor. Therefore, there are strict requirements on the material configuration of the thin film capacitor substrate. [0003] Most existing film capacitor substrates are made of metallic nickel. In order to increase the capacitance without affecting the performance of the capacitor, the purity and impurity composition of the nickel substrate cannot be ignored. If the nickel substrate contains undesired impurities, or its purity is insufficient, it will limit the capacity of the film capacitor, and may i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/002H01G4/33
Inventor 钱时昌
Owner LIYANG HUAJING ELECTRONICS MATERIAL