Circuit board, display module, and electronic apparatus

A technology for display modules and circuit boards, applied in the direction of circuits, printed circuit components, structural connections of printed circuits, etc., can solve problems such as joint failure and displacement, and achieve the effects of suppressing damage, good wiring connections, and increasing production.

Inactive Publication Date: 2013-06-26
SONY CORP
View PDF1 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, wiring and metal electrodes are each formed in a fine patter

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit board, display module, and electronic apparatus
  • Circuit board, display module, and electronic apparatus
  • Circuit board, display module, and electronic apparatus

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0041] [Implementation]

[0042] [structure]

[0043] figure 1 The configuration of a display module (display module 1) according to an embodiment of the present disclosure is schematically shown. The display module 1 is configured by bonding (connecting, adhering) a plurality of flexible printed circuit boards (hereinafter referred to as FPC) 20 on a part of the substrate 10. Note that the substrate 10 corresponds to a specific example of the “first substrate” of the present disclosure, and the FPC 20 corresponds to a specific example of the “second substrate” of the present disclosure. In addition, the configuration of the display module 1 (the substrate 10, the device portion, and the bonding portion 10A) other than the display portion 110A described later corresponds to a specific example of the “circuit board” of the present disclosure.

[0044] Made of such as polyimide (PI), polyethylene terephthalate (PET), polyethersulfone (PES), polyethylene naphthalate (PEN), polycarbona...

Example

[0083] (Comparative example)

[0084] Figure 9A with Figure 9B It is a schematic diagram for explaining the installation method of Comparative Example 1. When a plurality of bonding portions 10A are formed similarly to this embodiment, the method of Comparative Example 1 is to mechanically peel and bond to Figure 9A The method of FPC 20 in the area where connection failure X occurs is shown. In Comparative Example 1, the substrate 10 is designed to allow two-stage mounting. Subsequently, after the FPC 20 is peeled off, the FPC 20 is joined again. At this time, in the re-bonding, the FPC 20 is bonded to a region different from the first bonding in the wiring layer 11 using the alignment mark 12b arranged on the inner side of the alignment mark 12a used in the first bonding. Therefore, repair installation is possible.

[0085] However, as Figure 9B As shown, in Comparative Example 1, in addition to the connection failure X in bonding, mechanical peeling of the FPC 20 may cause...

Example Embodiment

[0092] [Modification 1]

[0093] In this embodiment, although the case where the cutout 13 is formed for each joining portion 10A1 has been described, similarly to Modification 1, the cutout 13 may be formed across a plurality of joining portions 10A1. For example, such as Picture 12 As shown, one (common) cut 13d can be formed for two adjacent joint portions 10A1. In this case, when a connection failure X occurs in the adjacent wiring layer 11 and FPC 20 pair at the first FPC bonding, a cut 13d is formed to cut off the two pairs of wiring layer 11 and FPC 20 as a whole. After that, FPC bonding is performed again for each wiring layer 11 to realize the repair installation as described above. This is particularly effective when the pitch between adjacent wiring layers 11 is very narrow.

[0094] Incidentally, although it has been described here that the cut 13d is formed across two adjacent joint portions 10A1, if connection failure X occurs across three or more consecutively arr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to view more

Abstract

The invention provides a circuit board, a display module, and an electronic apparatus The circuit board includes: a first substrate provided with a device section, the device section including one or a plurality of active devices; a plurality of first wiring layers each extending from the device section toward a periphery of the first substrate; and a plurality of second substrates each opposed to and bonded to the first wiring layer at the periphery of the first substrate and each having a second wiring layer, the second wiring layer being electrically connected to each of the first wiring layers. The first substrate has a cutout in one or more regions each facing one of the plurality of second substrates.

Description

technical field [0001] The present disclosure relates to a circuit board connected to a printed board on which electronic components such as integrated circuits are mounted, and to a display module and electronic equipment using the circuit board. Background technique [0002] In recent years, with the popularization of mobile phones, electronic paper, etc., in displays, a display section (display panel) and a drive section (driver, driver, circuit, etc.) method of bonding. The FPC is a printed circuit board including metal electrodes respectively made of copper or the like on a flexible base material such as polyimide and polyester fiber. [0003] At the time of bonding, the wiring drawn from the display portion is bonded to the metal electrodes formed on the FPC using an anisotropic conductive film or the like. However, wiring and metal electrodes are each formed in a fine pattern, and thus, displacement in bonding, bonding failure, and the like may occur. [0004] In t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K1/14G09F9/30
CPCG02F1/133305G02F1/1345H01L27/124G02F1/133354H01L27/15
Inventor 赤松圭一加藤祐一增田健太
Owner SONY CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap