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Polyamic acid resin solution containing interpenetrating polymer and laminate using same

A technology of polyamic acid resin and polyamic acid, applied in the direction of metal layered products, coatings, layered products, etc., can solve the problems that it is difficult to greatly improve the properties of polyamic acid resin, and achieve light weight, excellent performance, high The effect of subsequent strength

Active Publication Date: 2013-07-03
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, it is still difficult to significantly improve the properties of polyamic acid resins

Method used

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  • Polyamic acid resin solution containing interpenetrating polymer and laminate using same
  • Polyamic acid resin solution containing interpenetrating polymer and laminate using same
  • Polyamic acid resin solution containing interpenetrating polymer and laminate using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] Get 13.16g (0.037mole) of 4,4'-diphenylmethane bismaleimide (4,4'-diphenylmethane bismaleimide) into a 500ml reaction flask, add 250g of N-methylpyrollidone , NMP) and stirred to dissolve 4,4'-diphenylmethane bismaleimide completely. Under a nitrogen atmosphere, stirring was continued at 130° C. for 48 hours to obtain an NMP solution containing 5 wt % polydiphenylmethane bismaleimide.

Embodiment 2

[0054] Get 7.60g (0.021mole) of 4,4'-diphenylmethane bismaleimide (4,4'-diphenylmethane bismaleimide) and 0.14g (0.001mole) of barbituric acid (barbituric acid) into In a 500ml reaction flask, add 250g of N-methyl pyrrolidone (NMP) and stir to completely dissolve 4,4'-diphenylmethanebismaleimide and barbituric acid. Under a nitrogen atmosphere, stirring was continued at 130° C. for 48 hours to obtain an NMP solution containing 3 wt % diphenylmethane bismaleimide-barbituric acid copolymer.

Embodiment 3

[0056] The NMP solution containing the diphenylmethane bismaleimide of 5wt% of the embodiment 1 of getting 44.12g is placed in the reaction bottle of 500ml, adds the methylpyrrolidone (N-methylpyrollidone, NMP) of 208.18g, Nitrogen was blown and stirred to make the solution appear homogeneous. Get 12.60g (0.070mole) of p-phenylenediamine (p-phenylene diamine, p-PDA) and 3.50g (0.018mole) of 4,4'-diaminodiphenyl ether (4,4'-oxydianiline, 4,4'-ODA) was added to the above solution, and stirred under nitrogen atmosphere to completely dissolve p-phenylenediamine and 4,4'-diaminodiphenyl ether. Subsequently, 25.82 g (0.088 mole) of 4,4″-bis (phenylene dicarboxylic acid) dianhydride (BPDA) was added to the reaction flask in batches at intervals of 30 minutes, and Continue to stir. After 4,4"-biphenyltetraacid dianhydride is completely added to the reaction flask, continue to stir for 3 hours to obtain polydiphenylmethane-containing bismaleimide and imide with a solid content of abou...

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Abstract

Provided is a polyamic acid resin solution containing interpenetrating polymer. The solution includes a polyamic acid resin dissolved in a solvent. The polyamic acid resin includes an interpenetrating polymer formed of polyamic acid twining around hyper-branched polybismaleimide. The hyper-branched polybismaleimide includes a bismaleimide polymer, a bismaleimide oligomer, a barbituric acid-bismaleimide copolymer or combinations thereof. The invention provides a polyamic metal laminate.

Description

technical field [0001] The present invention relates to a polyamic acid resin composition, and in particular to a polyamic acid resin composition capable of providing good heat resistance, dimensional stability and adhesion to metal substrates, and using the polyamic acid resin composition A polyimide metal laminate made of a polyamic acid resin composition. Background technique [0002] Polyimide has been widely used in various industries, especially in the electronics industry. Because polyimide has good heat resistance and electrical insulation properties, it can form a laminated structure with metal substrates. This laminated structure can be used, for example, as a flexible circuit board, on which various electronic components are provided. [0003] Traditional flexible printed circuit boards, especially polyimide double-layer flexible printed circuit boards, are coated with a layer of polyamic acid resin on the metal substrate, and undergo a heat baking process to for...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08G73/10B32B15/08H05K1/05
CPCC08L79/08C09D179/08C08G73/0633C08L2205/02H05K1/056H05K2201/0154C08G73/1042C08G73/1046C08G73/105C08G73/1067C08G73/1071Y10T428/31681C08L79/085C08L79/04
Inventor 王宗雄潘金平许荣木
Owner IND TECH RES INST