Heat dissipation bottom plate, thin heat dissipation module and manufacturing method thereof

Abstract

The invention discloses a heat dissipation base plate, a thin-type heat dissipation module, and a method for manufacturing the dissipation base plate and the heat thin-type heat dissipation module. The heat dissipation base plate and the thin-type heat dissipation module are used for dissipating heat for a chip of a thin-type computer. The thin-type heat dissipation module comprises the heat dissipation base plate and a heat pipe, wherein the heat dissipation base plate is provided with an upper surface, a containing groove is formed in the upper surface, two side walls of the containing groove are respectively an arc face, the bottom portion of the containing groove is provided with an opening which penetrates through the heat dissipation base plate, the lower surface of the heat dissipation base plate is provided with a first slot and a second slot in a convex mode, the bore diameter of the second slot is larger than the bore diameter of the first slot, the first slot is located inside the second slot, the opening is located in the bottom portion of the first slot, the heat pipe is arranged inside the containing groove in an embedded mode and is fixed through arc faces of the two side walls of the containing groove in a wrapping mode, the upper surface of the heat pipe is flush with the surfaces of the two outer sides of the containing groove, and the heat pipe exposes out of part of the lower surface of the opening and is flush with the plane where the opening is located so that the heat pipe is flatly contacted with the chip in an attaching mode. The heat dissipation base plate can further lower the thickness of the thin-type computer.

Description

technical field [0001] The present invention relates to a heat dissipation module, in particular to a heat dissipation bottom plate, a thin heat dissipation module and a manufacturing method thereof. Background technique [0002] It is well known that the central processing chip (CPU) inside the electronic product will generate a large amount of heat energy during operation, which will increase the temperature. Therefore, after the electronic product is thin, how to quickly dissipate the large amount of heat accumulated in the chip in an effective space , is the focus of active research and development by those skilled in the art. [0003] Please refer to figure 1 , which shows a schematic cross-sectional view of an existing heat dissipation module assembled on a motherboard. A substrate 10 is disposed on the upper surface of the motherboard 1 , and a chip 100 is disposed on the substrate 10 . The heat dissipation module 2 includes a heat dissipation bottom plate 20 and a ...

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Problems solved by technology

[0006] However, the use of ultra-thin heat pipes will greatly reduce the heat transfer, and the manufacture of ultra-thin heat pipes is difficult, and the pass rate is low, so the cost is high. If the thickness t2 is removed, not only the total thickness of the module can be greatly reduced, but also a slightly thicker heat pipe can be used, which greatly improves the cost performance of the module and reduces the cost

[0007] However, if the thickness t2 is removed from the traditional heat dissipation base plate, the heat dissipation base plate cannot be integrally formed, and the base plate cannot be locked on the motherboard, nor can the heat pipe be fixed

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