Low-attenuation light emitting diode (LED)

A light-emitting diode, low-attenuation technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of LED products such as light attenuation, color drift, production yield reduction, etc., to reduce the impact of light and heat, shorten the movement path, The effect of preventing uneven settlement

Inactive Publication Date: 2013-07-24
HANGZHOU HANGKE OPTOELECTRONICS
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0004] When the fluorescent powder is mixed with organic materials such as epoxy and silicone rubber, the fluorescent powder will settle in the glue, resulting in a decrease in production yield and uneven light spots; at the same time, the colloid is directly covered on the chip, which is affected by the heat generated by the chip. , silicone rubber and other organic materials are easy to deteriorate, causing problems such as light attenuation, color drift, and shortened life of LED products

Method used

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  • Low-attenuation light emitting diode (LED)

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Embodiment Construction

[0017] The present invention will be further described below in conjunction with the accompanying drawings.

[0018] figure 1 Shown is an in-line light-emitting diode, the packaging structure of the light-emitting diode includes a bracket 2 with a groove on the top, a chip 1 is fixed in the groove of the bracket, the chip 1 is covered with a cladding layer 3, and the cladding layer 3 is covered with The fluorescence conversion layer 4 wraps a layer of light distribution body 5 outside the fluorescence conversion layer 4 and the upper part of the bracket.

[0019] figure 2 Shown is an in-line light-emitting diode, the packaging structure of the light-emitting diode includes a bracket 2 with a groove on the top, a chip 1 is fixed in the groove of the bracket, the chip 1 is covered with a cladding layer 3, and the cladding layer 3 is covered with The fluorescence conversion layer 4 is covered with a layer of light distribution body 5 on the fluorescence conversion layer 4 .

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Abstract

The invention relates to a low-attenuation light emitting diode (LED). The LED comprises a bracket, of which the top is provided with a groove, wherein a chip is fixedly arranged in the groove of the bracket, a coating layer covers the chip, a fluorescence conversion layer covers the coating layer, and a layer of light matching body covers the fluorescence conversion layer. According to the LED, due to an encapsulation structure that the chip is covered by adopting the coating layer, the photo-thermal effect on the fluorescence conversion layer caused by the chip can be reduced, the light attenuation is retarded, and the magnitude of color drift is reduced; and the motion path of fluorescent powder is shortened by the fluorescence conversion layer, and the nonuniformity of settlement of the fluorescent powder can be effectively prevented. The LED has the advantage that the problems of the current LED encapsulation that the light attenuation is high, light spots are nonuniform, the Bin entering ratio is low, and the like are solved.

Description

technical field [0001] The present invention relates to a low attenuation light emitting diode (LED). Background technique [0002] As a new lighting method, LED lighting is penetrating into the field of traditional lighting and has a tendency to replace it. It is more and more recognized by the public because of its advantages such as low power consumption, long life, and fast response. [0003] At present, in the LED packaging process, the light conversion method mostly adopts the method of dispensing glue after mixing phosphor and organic resin material, coating on the chip, and then using epoxy, silicone rubber, etc. for product packaging to complete the mechanical, damp and heat of the device. and other protective measures. [0004] When the fluorescent powder is mixed with organic materials such as epoxy and silicone rubber, the fluorescent powder will settle in the glue, resulting in a decrease in production yield and uneven light spots; at the same time, the colloid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/56H01L33/50
Inventor 严钱军高康
Owner HANGZHOU HANGKE OPTOELECTRONICS
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