Method for manufacturing embedded electronic circuit three-dimensional assembly substrate

Abstract

The invention provides a method for manufacturing an embedded electronic circuit three-dimensional assembly substrate, which can be used for increasing the interconnection assembling density and supplementing technical cryptosecurity for the three-dimensional assembly substrate. According to the technical scheme, the method is implemented by the following steps of: in the manufacturing process of a printed board, setting a planar printed board as an embedded substrate, and designing a cavity of which the area and height are matched with the size, height and printed board thickness of a layout device; assembling a device to be embedded on the bottom surface of the cavity in a surface mounting way, or directly laminating and burying into a designed and planed cavity position of the printed board, laminating, connecting a printed lead in the printed board with a device outside the substrate, and covering a printed board substrate with a certain thickness above and below the buried device; and after laminating the printed board, perforating at the pin position of the buried device, performing hole metallization through a buried blind via technique, surface device mounting and through hole insertion to realize interconnection so as to form a three-dimensional laminated assembly structure in which the embedded substrate is taken as a carrier.

Description

technical field [0001] The invention relates to a three-dimensional assembled electronic product board with a high-density, high-reliability three-dimensional structure formed by assembling various semiconductor integrated circuit chips or micro-devices constituting the circuit on a high-density multilayer circuit substrate by using micro-welding and packaging techniques. Level three-dimensional assembly substrate. Background technique [0002] Modern electronic products are developing in the direction of short, small, light, thin and highly reliable, high speed, high performance and low cost, especially airborne, arrow-borne and space-borne electronic products, as well as portable electronic products have a great impact on volume and weight. The requirements for reliability and reliability are becoming more and more stringent. It is required to continuously increase the assembly and interconnection density of circuits, to realize the miniaturization, light weight and high r...

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a new design to solve the problems that the timing of signal transmission between devices in the current printed board is difficult to guarantee, and the difficulty of manufacturing and assembling after high density is high, and it is easy to be copied and the technology is not easy to realize. A new method of structural form and electrical interconnection, which can increase the density of interconnection assembly and supplement technical security measures. A method for three-dimensional assembly of embedded electronic circuits on substrates

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