Light-emitting element
一种发光元件、障壁层的技术,应用在电气元件、半导体器件、电路等方向,能够解决亮度低下、解决情形不够充分等问题,达到高发光效率、低电阻发光效率的效果
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Embodiment 1、2
[0108] As Example 1, make figure 1 The light-emitting element 10 according to the first embodiment of the present invention is shown. Also, as Example 2, a Image 6 The light-emitting element 20 of the second embodiment of the present invention is shown.
[0109] In both Examples 1 and 2, the compositions of the barrier rib layers 106B, 207B of the multiple active layer portions 106, 207 were set to Al 0.85 GaInP, and the composition of the barrier layer 106C, 207C is Al 0.60 GaInP. Accordingly, the energy bandgap of the barrier layer on the side closer to the p-type cladding layer is made smaller than the energy bandgap of the barrier layer on the side closer to the n-type cladding layer.
[0110] Also, in Examples 1 and 2, for the superlattice barrier layers 105 and 205, the layers 105A and 205A are both made of a high Al bandgap layer material (AlInP layer) with a film thickness of 15 nm, and the layers 105B and 205B are both made of a film 15nm thick low energy bandga...
Embodiment 3、4
[0120] As Example 3, make figure 1 The light-emitting element 10 according to the first embodiment of the present invention is shown. Also, as Example 4, a Image 6 The light-emitting element 20 of the second embodiment of the present invention is shown.
[0121] In Examples 3 and 4, the compositions of the barrier rib layers 106B and 207B of the multiple active layer portions 106 and 207 were set to Al 0.85 GaInP, and the composition of the barrier layer 106C, 207C is set to Al 0.60 GaInP. Accordingly, the energy bandgap of the barrier layer on the side closer to the p-type cladding layer is made smaller than the energy bandgap of the barrier layer on the side closer to the n-type cladding layer.
[0122] Also, in Examples 3 and 4, the superlattice barrier layers 105 and 205 are all made of a high Al bandgap layer material (AlInP layer) with a film thickness of 15 nm for the layers 105A and 205A, and both the layers 105B and 205B are made of a film The low energy bandgap...
Embodiment 5、6
[0128] As Example 5, make figure 1 The light-emitting element 10 according to the first embodiment of the present invention is shown. Also, as Example 6, a Image 6 The light-emitting element 20 of the second embodiment of the present invention is shown.
[0129] In Examples 5 and 6, the compositions of the barrier rib layers 106B and 207B of the multiple active layer portions 106 and 207 were set to Al 0.85 GaInP, and the composition of the barrier layer 106C, 207C is Al 0.60 GaInP. Accordingly, the energy bandgap of the barrier layer on the side closer to the p-type cladding layer is made smaller than the energy bandgap of the barrier layer on the side closer to the n-type cladding layer.
[0130] Also, in Examples 5 and 6, the superlattice barrier layers 105 and 205 are all made of a high Al bandgap layer material (AlInP layer) with a film thickness of 15 nm for the layers 105A and 205A, and the layers 105B and 205B are both made of a film 15nm thick low energy bandgap...
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