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Dielectric substrate based on composite material and its manufacturing method

A technology of a dielectric substrate and a manufacturing method, which is applied to a dielectric substrate based on a composite material and its manufacturing field, can solve the problems of low dielectric constant and high loss, and achieve the effect of reducing loss

Active Publication Date: 2016-12-14
KUANG CHI INST OF ADVANCED TECH
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  • Abstract
  • Description
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Problems solved by technology

[0005] Based on this, in order to solve the technical problems of low permittivity and high loss of existing composite materials and dielectric substrates based on composite materials, a dielectric substrate based on composite materials is provided

Method used

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  • Dielectric substrate based on composite material and its manufacturing method
  • Dielectric substrate based on composite material and its manufacturing method
  • Dielectric substrate based on composite material and its manufacturing method

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Embodiment Construction

[0041] Reference will now be made in detail to the embodiments depicted in the accompanying drawings. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be understood by those skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known methods are not described in detail. procedures, components and circuits so as not to unnecessarily obscure the embodiments.

[0042] Please refer to figure 1 , is a schematic diagram of an embodiment of the composite material with high dielectric constant and low loss of the present invention. The composite material 10 includes a matrix material 101 , high dielectric constant metal particles 103 and an organic polymer material 102 wrapping the high dielectric constant metal particles 103 . The metal particles 103 with high dielectric constant and the organic pol...

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Abstract

The invention discloses a dielectric substrate based on a composite material. The dielectric substrate comprises a first conductive foil and a composite material adhered on the first conductive foil, the composite material comprises a parent material, a metal particle with high dielectric constant, and an organic polymer material for covering the metal particle; a core-shell structure is composed of the metal particle and the organic polymer material, the parent material and the organic polymer material can not dissolve with each other; the core-shell structure is discretely distributed and embedded in the parent material, wherein the particle size of the metal particle in high dielectric constant is between 0.1-2 microns. The electromagnetic loss can be reduced by more than 50% by adopting the dielectric substrate containing the core-shell structure composed of the metal particle and the organic polymer material. The invention further provides a manufacturing method of the dielectric substrate.

Description

technical field [0001] The invention relates to the field of composite materials, in particular to a dielectric substrate based on composite materials and a manufacturing method thereof. Background technique [0002] In communication systems, the size of electronic components is gradually developing towards high efficiency, multi-function and small size, which puts forward higher requirements for the performance of high-frequency materials. The rapid development of modern electronic information products, especially microwave radio frequency devices, the great improvement of integration and the application requirements of digitalization, high frequency and multifunctionality have challenged the general PTFE high frequency board and manufacturing process. [0003] At present, the high-frequency materials on the market mainly include PTFE substrate, thermosetting PPO, cross-linked polybutadiene substrate and epoxy resin composite substrate. It is very urgent to match the diele...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B15/02B32B15/08B32B37/15C08L63/00C08L23/00C08L33/04C08L83/04C08K9/10C08K3/08C08K3/10
Inventor 刘若鹏徐冠雄金曦
Owner KUANG CHI INST OF ADVANCED TECH
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