Polyimide-based adhesive composition, cured product, adhesive sheet, laminate, and flexible printed circuit board

A technology of polyimide and polyimide resin, which is applied in the direction of adhesives, lamination, and lamination devices, which can solve the problems of strong adhesive layer viscosity and insufficient heat-resistant adhesiveness, and achieve heat-resistant adhesiveness Excellent, not easy to foam, excellent adhesive effect

Active Publication Date: 2013-09-11
ARAKAWA CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] It is a known technology to use acrylonitrile butadiene rubber (NBR) instead of aromatic polyimide siloxane as the adhesive of carrier tape or c

Method used

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  • Polyimide-based adhesive composition, cured product, adhesive sheet, laminate, and flexible printed circuit board
  • Polyimide-based adhesive composition, cured product, adhesive sheet, laminate, and flexible printed circuit board
  • Polyimide-based adhesive composition, cured product, adhesive sheet, laminate, and flexible printed circuit board

Examples

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Example Embodiment

[0099] Example

[0100] Hereinafter, examples and comparative examples are given to specifically explain the present invention, but the scope of the present invention is not limited by them. In addition, in each example, parts and% are based on weight unless otherwise specified.

[0101]

Example Embodiment

[0102] Manufacturing example 1

[0103] Add 53.00g of 3,3',4,4'-benzophenonetetracarboxylic dianhydride (trade name "BTDA", Daicel Chemical Industry Co., Ltd.) into a reaction vessel equipped with a stirrer, a water trap, a thermometer, and a nitrogen introduction tube. (Produced by Co., Ltd.. Hereinafter, only referred to as benzophenone tetracarboxylic dianhydride), 185.50 g of cyclohexanone, 37.10 g of methylcyclohexane, and the solution was heated to 60°C. Then, 85.40 g of dimer diamine (trade name "PRIAMINE 1075", manufactured by CLOUD JEAN CO., LTD.) is added dropwise. Hereinafter, it is simply referred to as dimer diamine, and then imide is performed at 140°C for 1 hour Chemical reaction, a polyimide resin (A-1-1) solution (non-volatile content 38.0%) was obtained. In addition, the molar ratio of acid component / amine component was 1.04.

Example Embodiment

[0104] Manufacturing example 2

[0105] In the same reaction vessel as in Production Example 1, 53.00 g of 3,3',4,4'-diphenylsulfone tetracarboxylic dianhydride (manufactured by New Japan Rika Co., Ltd., trade name "Rikasido DSDA" was added. Only known as diphenylsulfone tetracarboxylic dianhydride), 185.50g cyclohexanone, 37.10g methylcyclohexane, and heat the solution to 60°C. Then, after gradually adding 76.82 g of dimer diamine, an imidization reaction was performed at 140°C for 1 hour to obtain a polyimide resin (A-1-2) solution with a non-volatile content of 36.0%. In addition, the molar ratio of acid component / amine component was 1.04.

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Abstract

The invention provides a novel polyimide-based adhesive composition, a cured product, an adhesive sheet, a laminate, and a flexible printed circuit board. The polyimide-based adhesive composition can be used in a form of uniform organic solvent solution and is excellent in heat-resisting adhesive property; and the polyimide-based adhesive composition is not easy to generate residual adhesive and is low in adhesiveness in a cured product state. The polyimide-based adhesive composition is formed by dissolving at least one kind of polyimide resin selected from the group consisting of [1] polyimide resin prepared from reaction of aromatic tetracarboxylic acids (a1) and diamines (a2) containing more than 30 mol% of dimeric diamines, [2] polyimide resin prepared from further chain elongation of the [1] polyimide resin through the (a2) component, [3] polyimide resin prepared from reaction of the [1] polyimide resin with epoxy-containing alkoxy silane partial condensation compounds (a3), and [4] polyimide resin prepared from reaction of the [2] polyimide resin and the (a3); and thermosetting resin and a fire retardant in an organic solvent.

Description

technical field [0001] The present invention relates to a polyimide-based adhesive composition, a cured product obtained from the adhesive composition, an adhesive sheet having the cured product, a laminate obtained using the adhesive sheet, and a flexible product obtained using the laminate. permanent printed substrates. Background technique [0002] As adhesives for printed circuit boards or build-up substrates (Build-up Substrates) used in electrical products or electronic equipment, aromatic compounds with excellent heat resistance, flexibility, and adhesion to circuit boards are favored. Polyimide-like resins. In addition, aromatic polyimide resins are also widely used in adhesive compositions for carrier tapes or sheets as temporary fixing units for transporting electronic components such as semiconductor elements, and are indispensable materials for manufacturing electrical products or electronic devices. [0003] However, many aromatic polyimide resins are poorly s...

Claims

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Application Information

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IPC IPC(8): C09J179/08C09J163/00C09J179/04C09J11/04C09J7/02B32B7/12B32B37/06B32B37/12H05K1/03
CPCC09J7/22C09J7/30C09J7/35C09J11/00C09J179/08C09J2203/00C09J2301/304C09J2301/50H05K1/0298
Inventor 田崎崇司盐谷淳合田秀树
Owner ARAKAWA CHEM IND LTD
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