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Polyimide-based adhesive composition, cured product, adhesive sheet, laminate, and flexible printed circuit board

A technology of polyimide and polyimide resin, which is applied in the direction of adhesives, lamination, and lamination devices, which can solve the problems of strong adhesive layer viscosity and insufficient heat-resistant adhesiveness, and achieve heat-resistant adhesiveness Excellent, not easy to foam, excellent adhesive effect

Active Publication Date: 2013-09-11
ARAKAWA CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] It is a known technology to use acrylonitrile butadiene rubber (NBR) instead of aromatic polyimide siloxane as the adhesive of carrier tape or carrier sheet (see Patent Document 5), but it also has insufficient heat-resistant adhesiveness, Adhesive layer has strong viscosity and other problems

Method used

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  • Polyimide-based adhesive composition, cured product, adhesive sheet, laminate, and flexible printed circuit board
  • Polyimide-based adhesive composition, cured product, adhesive sheet, laminate, and flexible printed circuit board
  • Polyimide-based adhesive composition, cured product, adhesive sheet, laminate, and flexible printed circuit board

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Embodiment

[0100] Hereinafter, although an Example and a comparative example are given and the present invention is concretely described, the scope of the present invention is not limited by them. In addition, in each example, parts and % are based on weight unless otherwise specified.

[0101]

manufacture example 1

[0103] In a reaction vessel with a stirrer, a water separator, a thermometer and a nitrogen gas introduction tube, add 53.00 g of 3,3',4,4'-benzophenone tetracarboxylic dianhydride (trade name "BTDA", Daicel Chemical Industry Co., Ltd. Co., Ltd. hereinafter referred to simply as benzophenone tetracarboxylic dianhydride), 185.50 g of cyclohexanone, and 37.10 g of methylcyclohexane, and the solution was heated to 60°C. Next, after dropping 85.40 g of dimer diamine (trade name "PRIAMINE 1075", manufactured by Croda Japan Corporation. Hereinafter, simply referred to as dimer diamine), the imide was carried out at 140° C. for 1 hour. reaction to obtain a polyimide resin (A-1-1) solution (38.0% of non-volatile content). In addition, the molar ratio of the acid component / amine component was 1.04.

manufacture example 2

[0105] In the same reaction vessel as in Production Example 1, 53.00 g of 3,3',4,4'-diphenylsulfone tetracarboxylic dianhydride (manufactured by Shin Nippon Chemical Co., Ltd., trade name "リカシツド DSDA") was added. Hereinafter, referred to simply as diphenylsulfonetetracarboxylic dianhydride), 185.50 g of cyclohexanone, 37.10 g of methylcyclohexane, and the solution was heated to 60°C. Next, after gradually adding 76.82 g of dimer diamines, imidization reaction was performed at 140 degreeC for 1 hour, and the polyimide resin (A-1-2) solution whose nonvolatile matter was 36.0% was obtained. In addition, the molar ratio of the acid component / amine component was 1.04.

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Abstract

The invention provides a novel polyimide-based adhesive composition, a cured product, an adhesive sheet, a laminate, and a flexible printed circuit board. The polyimide-based adhesive composition can be used in a form of uniform organic solvent solution and is excellent in heat-resisting adhesive property; and the polyimide-based adhesive composition is not easy to generate residual adhesive and is low in adhesiveness in a cured product state. The polyimide-based adhesive composition is formed by dissolving at least one kind of polyimide resin selected from the group consisting of [1] polyimide resin prepared from reaction of aromatic tetracarboxylic acids (a1) and diamines (a2) containing more than 30 mol% of dimeric diamines, [2] polyimide resin prepared from further chain elongation of the [1] polyimide resin through the (a2) component, [3] polyimide resin prepared from reaction of the [1] polyimide resin with epoxy-containing alkoxy silane partial condensation compounds (a3), and [4] polyimide resin prepared from reaction of the [2] polyimide resin and the (a3); and thermosetting resin and a fire retardant in an organic solvent.

Description

technical field [0001] The present invention relates to a polyimide-based adhesive composition, a cured product obtained from the adhesive composition, an adhesive sheet having the cured product, a laminate obtained using the adhesive sheet, and a flexible product obtained using the laminate. permanent printed substrates. Background technique [0002] As adhesives for printed circuit boards or build-up substrates (Build-up Substrates) used in electrical products or electronic equipment, aromatic compounds with excellent heat resistance, flexibility, and adhesion to circuit boards are favored. Polyimide-like resins. In addition, aromatic polyimide resins are also widely used in adhesive compositions for carrier tapes or sheets as temporary fixing units for transporting electronic components such as semiconductor elements, and are indispensable materials for manufacturing electrical products or electronic devices. [0003] However, many aromatic polyimide resins are poorly s...

Claims

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Application Information

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IPC IPC(8): C09J179/08C09J163/00C09J179/04C09J11/04C09J7/02B32B7/12B32B37/06B32B37/12H05K1/03
CPCC09J7/22C09J7/30C09J7/35C09J11/00C09J179/08C09J2203/00C09J2301/304C09J2301/50H05K1/0298
Inventor 田崎崇司盐谷淳合田秀树
Owner ARAKAWA CHEM IND LTD
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