A cathode multi-degree-of-freedom movement micro-electroforming device

Abstract

The invention discloses a negative multi-DOF (Degree of Freedom) motion micro-electroforming device. A mounting platform (11) is arranged on a device base (1), and an electroforming tank (3) is arranged on the device base (1); a negative horizontal reciprocating translation mechanism is arranged on the mounting platform (11), and a negative vertical lifting mechanism is arranged on the negative horizontal reciprocating translation mechanism; a negative fixed-axis rotating mechanism is arranged on the negative vertical lifting mechanism, and a negative clamping unit (13) is arranged on the negative fixed-axis rotating mechanism; a positive clamping unit (21) and the negative clamping unit (13) are vertically arranged in the electroforming tank (3) and face to each other. The negative motion system provided by the invention can realize that a negative pole can make horizontal reciprocating motion, fixed-axis rotation and the coupling of the two motions in an electroforming process, and by virtue of a follow-up shielding baffle, the thickness uniformity of an electroforming layer can be effectively improved, and the effect of evolved gas in the electroforming process on casting quality is eliminated. Meanwhile, the motion control system can control motion parameters, so that the efficiency of electroforming is improved to the maximum extent, and a dense and uniform electroforming layer is obtained.

Description

technical field [0001] The invention relates to a micro-electroforming device, in particular to a cathode multi-degree-of-freedom movement micro-electroforming device. Background technique [0002] At present, with the rapid development of MEMS technology, the demand for micro-devices continues to increase, and the economical and practical micro-electroforming process has gradually developed into an important micro-processing technology, and even the only processing method for some precision micro-parts. At the same time, electroforming, as an electrodeposition forming technology, has many influencing factors. How to obtain a uniform and dense casting layer has always been a difficult point of concern. During the electroforming process, due to the "edge concentration effect" of the electric field and the mutual shielding between the microstructures, the thickness uniformity of the electroformed layer is poor, and the structure of the high aspect ratio part is loose; the hydr...

AI Technical Summary

Problems solved by technology

The cathodes of existing electroforming devices are either fixed or have a single form of movement. For example, "a micro electroforming machine tool" disclosed in CN102586813A realizes the arrangement of cathodes and anodes at any angle in the electroforming tank to meet the requirements of different electroforming processes

However, this device still cannot solve the problem of poor thickness uniformity of electroformed parts, and the surface is prone to defects such as pores and hydrogen embrittlement.

Images