Manufacturing method for multi-layer ceramic capacitor

Abstract

The invention relates to a manufacturing method for a multi-layer ceramic capacitor. The manufacturing method includes: manufacturing a ceramic stacking body comprising a plurality of ceramic films and a plurality of inner electrode films, wherein the ceramic films and the inner electrode films are stacked alternatively; heating the ceramic stacking body to 240-280 DEG C, keeping the temperature for 2-4 hours, heating the ceramic stacking body to 500-800 DEG C after the temperature of 240-280 DEG C of the ceramic stacking body is kept for 2-4 hours in an neutral atmosphere, keeping the temperature for 3-6 hours, cooling the ceramic stacking body to the room temperature; in a reduction atmosphere, heating the ceramic stacking body which is cooled to the room temperature to 1200-1320 DEG C with the temperature rising rate as 30-40 DEG C / minute, sintering for 1.5-3 hours, cooling the ceramic stacking body to the room temperature with the temperature dropping rate as 3-8 DEG C / minute to form the plurality of ceramic layers and the plurality of inner electrode layers which are stacked alternatively to form the multi-layer ceramic capacitor. By means of the manufacturing method, the inner electrode layers which are even and continuous can be formed.

Description

technical field [0001] The invention relates to the field of electronic components, in particular to a preparation method of a multilayer ceramic capacitor. Background technique [0002] In the preparation process of multilayer ceramic capacitors, it is necessary to sinter the ceramic laminate with multiple internal electrode films and multiple ceramic films alternately stacked at high temperature to make it dense and have desired electrical properties. After sintering, the ceramic laminate forms a dense and uniform ceramic body with multiple internal electrode layers and multiple ceramic dielectric layers stacked alternately; among them, the internal electrode film forms the internal electrode layer of the multilayer ceramic capacitor, and the ceramic film forms the multilayer ceramic The ceramic dielectric layer of the capacitor. [0003] However, during the sintering process, the internal electrode film shrinks, so that the expected uniform and continuous internal electr...

AI Technical Summary

Problems solved by technology

[0003] However, during the sintering process, the internal electrode film shrinks, so that the expected uniform and continuous internal electrode layer is agglomerated or disconnected at different positions after sintering, especially under the development trend of miniaturization and high capacity, the internal electrode layer It needs to be thinned, and the phenomenon of agglomeration or disconnection of the internal electrode layer at different parts is more likely to occur, and the degree is even worse.

The resulting problem is that, on the one hand, when the capacitor is loaded with voltage, the electric field is concentrated at the agglomeration of the internal electrodes, which deteriorates the insulation characteristics and life characteristics of the capacitor.

On the other hand, the disconnection of the internal electrode layer reduces the effective facing area of ​​the internal electrode layers of different polarities, thereby reducing the capacitance of the capacitor.

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