A preparation method of a ceramic heat dissipation base for LED packaging
A technology of LED packaging and heat dissipation base, which can be used in the manufacture of printed circuits, printed circuits, semiconductor devices, etc., and can solve the problems of high price and large investment.
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[0013] The invention provides a method for preparing a ceramic heat dissipation base for LED packaging, the method comprising the following steps:
[0014] S1 sequentially coating inks A and B on at least one surface of the ceramic substrate, the inks A and B have different solubility in different solutions;
[0015] S2 uses the laser to draw the circuit diagram on the surface of the ceramic substrate obtained in step S1 coated with ink A and ink B;
[0016] S3 immersing the ceramic substrate on which the circuit diagram has been drawn is activated in the activation solution;
[0017] S4 removes the ink B on the surface of the ceramic substrate after activation;
[0018] S5 metallizes the ceramic substrate obtained in step S4;
[0019] S6 removes ink A.
[0020] The biggest difference between the method of the present invention and DPC is that the method of forming the circuit is different. DPC needs to carry out steps such as sputter coating, film sticking, exposure, devel...
Embodiment 1
[0044] Will be 114×114×0.38mm 3 Al 2 o 3Ultrasonic cleaning of the ceramic cast sheet in acetone for 3 minutes; transfer to an acidic roughening solution at 50°C for 90 minutes, then rinse and dry; screen printing ink A, screen printing B on one side after UV curing Ink, then bake at 110°C for 30 minutes, after cooling to room temperature, print B ink on the other side, and bake at 110°C for 30 minutes; use drawing software to draw a circuit diagram, import it into the laser control software, and adjust the laser focal length , set the laser marking parameters, put the ceramic sheet processed in the above steps on the fixture and fix it, turn on the laser to draw the circuit diagram; after the marking is completed, immerse it in the acid-based colloidal palladium activation solution for activation for 1min. Then rinse the ceramic sheet with tap water to prevent the residual activation solution from being brought into the copper plating solution. Then put it into 0.1mol NaOH...
Embodiment 2
[0046] Will be 40×40×0.635mm 3 The AlN ceramic cast sheet was ultrasonically cleaned in acetone for 3 minutes; then transferred to an acidic roughening solution at 50°C for 90 minutes, then rinsed and dried; screen printed A ink, and screened on one side after UV curing Print B ink, then bake at 110°C for 30 minutes, after cooling to room temperature, print B ink on the other side, also bake at 110°C for 30 minutes; use drawing software to draw 15×15mm 2 area and 10 lines whose width is 0 (set value) and the distance between them is twice the line width (actual width), import them into the laser control software, adjust the laser focal length, set the laser marking parameters, and set the The ceramic sheet processed in the above steps is fixed on the fixture, and the laser is turned on to draw the circuit diagram; after marking, it is immersed in the acid-based colloidal palladium activation solution for activation for 1 min. Then rinse the ceramic sheet with tap water to pre...
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