Novel high-density multilayer circuit chip flip encapsulation structure and manufacturing method

Abstract

The invention relates to a novel high-density multilayer circuit chip flip encapsulation structure and a manufacturing method thereof. The encapsulation structure comprises a first circuit layer (10), a chip (2) and a second circuit layer (11), wherein an external ink layer (9) is arranged on the back sides of the first circuit layer (10) and an insulation material layer (6), a metallic ball (8) is arranged at the position of an outer pin (7), an inner pin (12) is arranged on the front side of the second circuit layer (11), an internal ink layer (1) is arranged on the periphery of the second circuit layer (11) and the inner pin (12), the chip (2) is mounted on the front side of the inner pin (12) upside down, and molding compound (4) is enveloped on the periphery of the chip (2). The novel high-density multilayer circuit chip flip encapsulation structure and the manufacturing method thereof have the beneficial effects that the thickness of a chip encapsulation carrier plate is reduced, and the ultra-thin high-density encapsulation is realized; the level of reliability is improved; the technical capacity on high-density circuit is truly achieved; the warping problem of a traditional substrate during the encapsulation process is radically solved.

Description

technical field [0001] The invention relates to a novel high-density multilayer circuit chip flip-chip packaging structure and a manufacturing method, belonging to the technical field of semiconductor packaging. Background technique [0002] The current high-density substrate packaging structure such as Figure 25 As shown, the manufacturing process is mainly to form a multi-layer circuit board by stacking the core material of the glass fiber board by accumulating materials. The holes between the circuit layers are opened by laser drilling, and then the holes are plated to complete the electrical circuit board. connect. [0003] The above-mentioned current high-density substrate packaging structure has the following deficiencies and defects: [0004] 1. There is an extra layer of glass fiber material, and also the cost of an extra layer of glass fiber; [0005] 2. Because there is an extra layer of glass fiber board core layer, the thickness is about 100~150μm, so it is im...

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Problems solved by technology

[0005] 2. Because there is an extra layer of glass fiber board core layer, the thickness is about 100~150μm, so it is impossible to achieve ultra-thin packaging design;

[0006] 3. Glass fiber itself is a kind of foaming material, so it is easy to absorb moisture and moisture due to the storage time and environment, which directly affects the safety capability or reliability level of reliability;

[0007] 4. The connection between the circuit layers is made by laser drilling, and then copper plating is carried out. The aperture formed by laser drilling is large, and it is difficult to achieve high-density design and manufacture.

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