Thin-layer fluid type low-stress polishing device
A polishing device and low stress technology, applied in the field of ultra-precision optical processing, can solve the problems of medium and high frequency errors, small material removal rate, low processing efficiency, etc., achieve high polishing precision, low stress processing, and improve the effect of medium and high frequency errors
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[0027] specific implementation plan
[0028] The device of the present invention will be further described below in conjunction with the accompanying drawings.
[0029] figure 1It is a structural schematic diagram of the device of the present invention, including an anode plate 1, a sealed working cabin 2, a workpiece 3, a cathode platform 4, a lifting platform 5, a polishing waste liquid 6, a waste liquid separation and stirring device 7, a first conduit 8, and a booster pump 9 , a second conduit 10, a polishing liquid collecting device 11, a two-dimensional motion platform 12, an anode probe 13, a shaping nozzle 14, and an electrorheological polishing liquid 15. The cathode platform 4 is insulated and fixed on the platform of the lifting platform 5 and connected to the cathode of the high-voltage power supply; the anode plate 1 is opposite to the cathode platform 4, and is insulated and fixed on the top of the sealed working cabin 2; the sealed working cabin 2 connects the ...
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