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LED eutectic device and method for utilizing hot plate and light waves to conduct composite heating

A composite heating and light wave technology, applied in the direction of electric heating devices, metal processing equipment, electrical components, etc., can solve the problems that affect the yield and reliability of LED devices, the large difference in the quality of substrate eutectic, and the inability to form chips and substrates. Achieve the effects of delaying decay, high product yield, and improving stability

Active Publication Date: 2013-10-09
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the one hand, since the substrate will definitely shift to a certain extent during the handling process, when the eutectic reflow furnace is used for eutectic welding, the chip and the substrate cannot form a good-quality eutectic layer, which will affect the yield and reliability of LED devices. In addition, due to the temperature difference in each area of ​​the eutectic reflow furnace, the temperature uniformity is poor, and the eutectic quality varies greatly at different positions on the substrate; on the other hand, the resulting process is not concentrated, requiring more manpower and material resources to improve device production costs, reducing its market competitiveness

Method used

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  • LED eutectic device and method for utilizing hot plate and light waves to conduct composite heating
  • LED eutectic device and method for utilizing hot plate and light waves to conduct composite heating
  • LED eutectic device and method for utilizing hot plate and light waves to conduct composite heating

Examples

Experimental program
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Effect test

Embodiment 1

[0043] like Figure 1 to Figure 2 As shown, an LED eutectic device using a hot plate and light wave composite heating includes a die placement area, a substrate preheating area, and a high-temperature light wave eutectic area arranged in sequence from left to right.

[0044] The die placement area includes a dispensing head 5, a plastic tray 4, a vacuum nozzle 7, a blue film 6, and a substrate carrier 1, the dispensing head 5 is arranged on the glue tray 4, and the vacuum nozzle 7 Set on the blue film 6, the glue disc 4 and the blue film 6 are arranged above the substrate carrier 1 from left to right; the substrate preheating zone includes a preheating plate 2;

[0045] The high-temperature light-wave eutectic area includes a high-temperature hot plate 3, a light wave tube assembly 8 that is positioned above the high-temperature hot plate 3 and can move back and forth, and the high-temperature hot plate 3 is located on the focal plane of the light wave tube; and the substrate ...

Embodiment 2

[0053] A method for carrying out eutectic using a hot plate and an LED eutectic device heated by light wave composite heating, comprising the steps of:

[0054] (1) the substrate 9 ( Figure 7 , Figure 8 ) to the left end of the substrate bearing seat 1 in the die placement area, and use the glue dispensing head 5 to draw an appropriate amount of flux 93 from the glue tray 4 and evenly point it on the pad 92 of the substrate unit 91 ( image 3 , Figure 4 );

[0055] (2) Move the substrate 9 to the right end of the substrate carrier 1 in the die placement area, use the vacuum nozzle 7 to absorb the LED chip 94 from the blue film 6 and place it on the pad 92 of the substrate unit 91 dotted with flux 93 superior( Figure 5 );

[0056] (3) Pass the substrate 9 dotted with flux 93 to the preheating plate 2 in the substrate preheating zone for preheating, the preheating time is 2min, and the preheating temperature is 145°C;

[0057] (4) Pass the preheated substrate 9 to the hi...

Embodiment 3

[0061] A method for carrying out eutectic using a hot plate and an LED eutectic device heated by light wave composite heating, comprising the steps of:

[0062] (1) the substrate 9 ( Figure 7 , Figure 8 ) to the left end of the substrate bearing seat 1 in the die placement area, and use the glue dispensing head 5 to draw an appropriate amount of flux 93 from the glue tray 4 and evenly point it on the pad 92 of the substrate unit 91 ( image 3 , Figure 4 );

[0063] (2) Move the substrate 9 to the right end of the substrate carrier 1 in the die placement area, use the vacuum nozzle 7 to absorb the LED chip 94 from the blue film 6 and place it on the pad 92 of the substrate unit 91 dotted with flux 93 superior( Figure 5 );

[0064] (3) Pass the substrate 9 dotted with flux 93 to the preheating plate 2 in the substrate preheating zone for preheating, the preheating time is 3 minutes, and the preheating temperature is 150°C;

[0065] (4) Pass the preheated substrate 9 to...

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Abstract

The invention discloses an LED eutectic device and method for utilizing a hot plate and light waves to conduct composite heating. The LED eutectic device utilizes the hot plate and the light waves to conduct composite heating and comprises three functional zones which are sequentially a pipe core placing zone, a base plate preheating zone and a high-temperature light wave eutectic zone. The LED eutectic method includes the steps that firstly a base plate is transferred to the position where scaling powder is dotted, the moderate scaling powder is dotted on a bonding pad of the base plate, then the base plate is moved to the pipe core placing position, and LED chips are sucked to and placed on the bonding pad of the base plate; the base plate is transferred to the base plate preheating zone for preheating; lastly the base plate is transferred to the high-temperature light wave eutectic zone for heating, a light wave pipe slowly moves to sweep the base plate after the base plate is heated, the temperature of the base plate raises to an eutectic temperature, an eutectic layer is formed, and LED eutectic is achieved. The LED eutectic device is novel in structure and convenient to use. By the adoption of the high-temperature light wave eutectic zone, the temperature of the base plate can be stable and uniform, excellent eutectic quality can be guaranteed, production time is reduced, the technological process is accurate in control, yield of produced products is high, and production cost is low.

Description

[0001] technical field [0002] The invention relates to a light wave heating device, in particular to an LED eutectic device and method based on planar substrates with different structures, which utilizes composite heating of a hot plate and an infrared light tube, integrates a tube core placement area, and can be rapidly realized. Background technique [0003] As the pre-process of LED packaging process, die bonding is a very important link in the production chain. The quality of die bonding is directly related to the production yield of products and the reliability of devices. At present, the mainstream methods of die-bonding include die-bonding glue welding and eutectic alloy eutectic welding. With the continuous development of the LED industry, the application of high-power LEDs is becoming more and more extensive. However, the problem that greatly affects the light output efficiency of high-power LEDs is the inability to dissipate heat. Nice work out. Eutectic technol...

Claims

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Application Information

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IPC IPC(8): B23K3/04H01L33/64H01L33/48H01L33/00
Inventor 汤勇李宗涛朱本明丁鑫锐余树东
Owner SOUTH CHINA UNIV OF TECH