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Aluminum matrix composite with low expansion and high thermal conductivity reinforced by mixing graphite and silicon

An aluminum-based composite material and composite material technology, which is applied in the field of graphite/silicon hybrid reinforced aluminum-based composite materials with high thermal conductivity and low expansion, can solve problems such as poor thermal stability and thermal shock resistance, poor mechanical properties, and poor stability, and achieve Effect of improving interface, thermal conductivity and thermal expansion coefficient to maintain stable, good mechanical properties

Active Publication Date: 2013-10-09
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problems of poor interface stability, poor mechanical properties, poor thermal stability and thermal shock resistance of existing graphite-aluminum composite materials, and to provide a graphite / silicon hybrid reinforced high thermal conductivity and low expansion aluminum matrix composite with high mechanical properties Material

Method used

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  • Aluminum matrix composite with low expansion and high thermal conductivity reinforced by mixing graphite and silicon
  • Aluminum matrix composite with low expansion and high thermal conductivity reinforced by mixing graphite and silicon
  • Aluminum matrix composite with low expansion and high thermal conductivity reinforced by mixing graphite and silicon

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Embodiment 1

[0023] The graphite / silicon hybrid reinforced aluminum matrix composite material with high thermal conductivity and low expansion in this embodiment is prepared by the pressure infiltration method in the prior art.

[0024] In this embodiment, graphite particles are in the form of scales, with a volume fraction of 40%, silicon is in granular form, with a volume fraction of 20%, and the rest is aluminum alloy.

[0025] The interfacial modification additives in this embodiment are Zr (0.5% by mass) and Ti (0.2% by mass), which are blended into a commercial Al-Si alloy in the state of an intermediate alloy at 750° C. under the protection of argon.

[0026] attached by figure 1 Metallographic photos of graphite / silicon hybrid reinforced aluminum matrix composites with high thermal conductivity and low expansion, attached figure 2 Graphite / silicon hybrid enhanced high thermal conductivity and low expansion aluminum matrix composite material scanning electron microscope photos, an...

Embodiment 2

[0028] The graphite / silicon hybrid reinforced aluminum matrix composite material with high thermal conductivity and low expansion in this embodiment is prepared by the pressure infiltration method in the prior art.

[0029] In this implementation example, the graphite particles are granular, with a volume fraction of 60%, the silicon is granular, and the volume fraction is 10%, and the rest is aluminum alloy.

[0030] The interface modifying additives in this embodiment are Mg (3.5% by mass) and Sc (0.1% by mass), which are blended into a commercial Al-Si alloy in the state of an intermediate alloy at 750° C. under the protection of argon.

[0031] In the prepared composite material, the graphite and silicon particles are evenly distributed in the matrix, forming a stable amorphous interface with the matrix, and the thickness is 45nm. Al was not found 4 C 3 Mutually. The structure of the composite material is dense, and its physical properties are: room temperature, thermal...

Embodiment 3

[0033] The graphite / silicon hybrid reinforced aluminum matrix composite material with high thermal conductivity and low expansion in this embodiment is produced by powder metallurgy in the prior art.

[0034] In this embodiment, graphite particles are in the form of scales, with a volume fraction of 60%, silicon is in granular form, with a volume fraction of 10%, and the rest is aluminum alloy.

[0035] The interfacial modification additives in this embodiment are Zr (3.5% by mass) and Sc (0.1% by mass), which were milled with pure aluminum powder for 10 hours under the protective atmosphere of argon. Then add graphite particles and silicon particles, and continue low-speed ball milling for 0.5 hours to carry out powder metallurgy.

[0036] In the prepared composite material, the graphite and silicon particles are evenly distributed in the matrix, forming a stable amorphous interface with the matrix, and the thickness is 50nm. Al was not found 4 C 3 Mutually. The structure...

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Abstract

The invention relates to an aluminum matrix composite with low expansion and high thermal conductivity reinforced by mixing graphite and silicon. The aluminum matrix composite comprises an aluminum matrix or an aluminum alloy and graphite and silicon, the volume fraction of the graphite is 20%-65%, the volume fraction of the silicon is 3%-40%, the rest is aluminum or aluminum alloy, and the composite also comprises an interfacial modification additive for inhibiting the generation of graphite aluminum harmful interface reactant Al4C3. Compared with the prior art, the additive is introduced into the graphite or silicon or aluminum composite, additive elements are used for aluminum carbon interfacial modification, so as to inhibit the harmful Al4C3 phase from generating, and the thermal conductivity is improved by reducing the interface thermal resistance. The prepared composite has a compact structure and excellent mechanical property, the thermal conductivity of the composite is 210-780W / mK, the coefficient of thermal expansion is 2.3-10*10<-6>m / K. The aluminum matrix composite is mainly used as the electronic packaging material and the heat conduction material in high power density and high heating flux density electronic or micro-electronic equipment.

Description

technical field [0001] The invention belongs to the field of composite materials, in particular to a graphite / silicon hybrid reinforced aluminum-based composite material with high thermal conductivity and low expansion. Background technique [0002] With the development of high-performance, high-density, multi-functional and miniaturized microelectronic equipment, modern microelectronic equipment has higher and higher requirements for thermal management materials: such as high thermal conductivity, low expansion coefficient, light weight, good reliability Processability and acceptable price etc. Traditional thermal management materials have been unable to meet the above requirements at the same time. For example, although the thermal conductivity of pure copper reaches 398W / m.K, the thermal expansion coefficient is as high as 16.5×10 -6 / K, Cu / W, Cu / Mo, and Invar / Cu, although the expansion coefficients meet the requirements, their thermal conductivity is limited (200W / m.K)...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C21/00C22C49/06C22C101/10
Inventor 陈哲周聪王浩伟
Owner SHANGHAI JIAO TONG UNIV
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