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High-thermal-conductivity graphite-high silicon aluminium-based composite material and preparation process for same

A technology of high thermal conductivity graphite and composite materials, applied in the field of composite materials, can solve problems such as insufficient thermal conductivity, achieve low density, avoid delamination and cracking, and achieve low cost effects

Active Publication Date: 2013-10-09
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem of insufficient thermal conductivity of existing high-silicon-aluminum-based composite materials, so as to obtain a high-thermal-conductivity graphite high-silicon-aluminum-based composite material with excellent comprehensive performance and meet the heat dissipation requirements of electronic packaging materials and its preparation process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] The volume fraction of graphite powder in the high-thermal conductivity graphite high-silicon-aluminum matrix composite material is 14%, and the rest is high-silicon-aluminum matrix. Its preparation steps are: (1) graphite powder and silicon powder are mechanically stirred in a mixer at a mass ratio of 1: 3.5 until the two powders are evenly mixed, wherein the diameter of the silicon powder is 10 microns, and the diameter of the graphite powder is 500 microns; (2) Put the mixed powder into a heat treatment furnace for vacuum hot-pressing sintering to form a prefabricated block, the sintering temperature is 1000°C, and the sintering time is 12h; (3) Put the sintered prefabricated block into a mold and preheat to 400°C , the aluminum alloy ZL101 is heated in a crucible until it melts; (4) pouring the aluminum or aluminum alloy melt into the mold; (5) applying an axial pressure of 50 MPa by a hydraulic press to force the aluminum or aluminum alloy melt to infiltrate into th...

Embodiment 2

[0022] The volume fraction of graphite powder in the high-thermal conductivity graphite high-silicon-aluminum matrix composite material is 37%, and the rest is high-silicon-aluminum matrix. Its preparation steps are: (1) graphite powder and silicon powder are mechanically stirred in a mixer in a mass ratio of 1:1 until the two powders are mixed evenly, wherein the diameter of the silicon powder is 20 microns, and the diameter of the graphite powder is 300 microns; (2) Put the mixed powder into a heat treatment furnace for vacuum hot-pressing sintering to form a prefabricated block, the sintering temperature is 1100°C, and the sintering time is 12h; (3) Put the sintered prefabricated block into a mold and preheat to 450°C , the aluminum alloy ZL102 is heated in a crucible until it melts; (4) pouring the aluminum or aluminum alloy melt into the mold; (5) applying an axial pressure of 75MPa by a hydraulic press to force the aluminum or aluminum alloy melt to infiltrate into the pr...

Embodiment 3

[0024] The volume fraction of graphite powder in the high-thermal conductivity graphite high-silicon-aluminum matrix composite material is 66%, and the rest is high-silicon-aluminum matrix. Its preparation steps are: (1) graphite powder and silicon powder are mechanically stirred in a mixer in a mass ratio of 1:0.3 until the two powders are mixed evenly, wherein the diameter of the silicon powder is 50 microns, and the diameter of the graphite powder is 200 microns; (2) Put the mixed powder into a heat treatment furnace for vacuum hot pressing and sintering to form a prefabricated block, the sintering temperature is 1200°C, and the sintering time is 12h; (3) Put the sintered prefabricated block into a mold and preheat to 500°C , the aluminum alloy ZL104 is heated in a crucible until it melts; (4) pouring the aluminum or aluminum alloy melt into the mold; (5) applying an axial pressure of 100MPa by a hydraulic press to force the aluminum or aluminum alloy melt to infiltrate into...

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Abstract

The invention relates to a high-thermal-conductivity graphite-high silicon aluminium-based composite material and a preparation process for the same. The composite material is composed of, in volume fraction, 10-70% of graphite, 5-30% of silicon, and the balance of aluminium or aluminium alloy. The preparation process comprises the following steps of: (1) uniformly mixing graphite powder and silicon powder to obtain mixed powder; (2) placing the mixed powder in a heat treatment furnace, and performing vacuum hot-pressing sintering to form a precast block; (3) placing the sintered precast block in a die and preheating, and heating aluminium or aluminium alloy in a crucible until aluminium or aluminium alloy is melted; (4) pouring an aluminium melt or aluminium alloy melt in the die; (5) applying an axial pressure by a hydraulic machine, and enabling the aluminium melt or aluminium alloy melt to infiltrate in pores in the precast block; and (6) cooling and releasing the die, and taking out the composite material. Compared with the prior art, the composite material obtained by the preparation process disclosed by the invention is low in density and cost, and has the characteristics of low expansibility, high thermal conductivity and the like simultaneously.

Description

technical field [0001] The invention belongs to the field of composite materials, and in particular relates to a high-thermal conductivity graphite high-silicon-aluminum matrix composite material and a preparation process thereof. Background technique [0002] High-silicon aluminum-based composites are a new type of aluminum-based composites with low expansion developed in recent years, and are widely used in thermal management of electronic packaging materials. Osprey Metal Company in Europe has prepared high-silicon-aluminum matrix composites by both spray deposition and hot isostatic pressing methods, but these methods require high equipment, complex processes, and high costs. In addition, with the continuous increase of thermal power density of electronic devices, high-silicon reinforced aluminum matrix composites cannot meet the heat dissipation requirements of high-power devices due to insufficient thermal conductivity. Chinese Patent No. 200410043855.9 describes a "l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C21/00C22C1/10
Inventor 周聪陈哲王浩伟
Owner SHANGHAI JIAO TONG UNIV
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