Vacuum drying device and photolithographic process

Abstract

A vacuum drying apparatus comprises a vacuum chamber provided with an exhaust vent and a chamber door, a vacuum pumping apparatus in communication with the exhaust vent, and a heating assembly disposed in the vacuum chamber. A vacuum drying method by using the vacuum drying apparatus comprises: when vacuum drying is performed on a substrate coated with a photoresist, simultaneously performing the heating and vacuum drying on the photoresist, the vacuum degree preferably ranging from 26Pa to 500Pa during the drying, and the heating temperature preferably ranging from 30 to 90 degrees centigrade, so as to produce less hardening films, thereby reducing the residual amount of a solvent in the photoresist, and improving the photolithographic accuracy.

Description

technical field [0001] The invention relates to the technical field of substrate manufacturing, in particular to a vacuum drying device and a photolithography process. Background technique [0002] At present, the pattern on the substrate is generally formed by a photolithography process. The specific process is as follows: firstly, the photoresist is coated on the substrate, and then the photoresist on the substrate is vacuum-dried. Finally, after pre-baking, exposure, and development, Form the desired pattern on the substrate. [0003] Vacuum drying is an intermediate link in the photolithography process, which is used to remove the solvent in the photoresist. Therefore, the drying effect on the photoresist will directly affect the properties of the photoresist and the effects of subsequent exposure and development. At present, vacuum drying is generally completed in a vacuum drying device. The inventors of the present application have found that when using an existing va...

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Problems solved by technology

At present, vacuum drying is generally completed in a vacuum drying device. The inventors of the present application have found that when using an existing vacuum drying device to dry the photoresist, because the vacuum drying is performed from the surface of the photoresist, it is easy to A hardened film is formed on the surface of the photoresist, making it difficult for the solvent in the photoresist in the hardened film to volatilize, which affects the slope angle of the photoresist (Profile)

like figure 1 As shown, it is the slope angle topography diagram of the resist when vacuum drying at room temperature; the photoresist 2 is located on the substrate 1, and since there are more solvent residues in the photoresist 2 after drying, the slope angle a of the photoresist is 20°~ 30°, it can be seen that the slope angle of the photoresist is small, which affects the photolithography accuracy

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