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Thermal reversible adhesive as well as preparation method and application thereof

A technology of adhesives and solvents, which is applied in the field of thermoreversible adhesives and preparations, can solve the problems of multiple components, complicated preparation, and non-reusable use, and achieve the effect of simple raw materials and simple processes

Inactive Publication Date: 2013-10-30
HEFEI GENIUS NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Patent CN1133706 discloses an aluminum-plastic composite hot-melt adhesive, which is composed of organic solvent, vinyl chloride-vinyl acetate-maleic anhydride ternary copolymer resin, ethylene-vinyl acetate copolyester, ethylene-ethyl acrylate copolyol and Composed of multi-component copolyester, this hot melt adhesive has short curing time, modularity, high strength, and can be reused, but it is not resistant to acid and alkali, and has many components, making the preparation complicated
Patent CN1231555 discloses a room-temperature-curing high-temperature adhesive, which has excellent high-temperature resistance, but cannot be reused, and has high requirements for raw materials

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] The raw materials are weighed according to the following parts by weight:

[0036] 40 parts of furfurone resin,

[0037] 60 parts of diphenylmethane bismaleimide;

[0038] The above-mentioned raw materials are placed in a container, mechanically stirred, the stirring speed is 30 rpm, the stirring temperature is 0 °C, and the stirring time is 1 min, so that the components are dispersed evenly to form a uniform mixture, and the thermoreversible adhesive is prepared. For ceramic-ceramic bonding:

[0039] Using ceramic as the bonding material, the surface of the ceramic to be bonded is cleaned, and after drying, double-sided adhesive coating is formed to form an adhesive coating with a thickness of 1 mm, and the bonding is carried out at 30 °C. the bonded ceramic A1; put the bonded ceramic A1 at 100 °C for 30 minutes, the cured adhesive becomes fluid, and the bonded ceramic A1 is released; the separated ceramic is bonded again in the original position After 24 hours at 3...

Embodiment 2

[0044] The raw materials are weighed according to the following parts by weight:

[0045] 50 parts of furfuryl alcohol resin,

[0046] 50 parts of N-phenylmaleimide;

[0047] The above-mentioned raw materials were placed in a container, stirred manually, the stirring speed was 30 rpm, the stirring temperature was 25 °C, and the stirring time was 3 min, so that the components were dispersed evenly to form a uniform mixture, and the thermoreversible adhesive was prepared.

[0048] For glass-to-glass bonding:

[0049] Using glass as the bonding material, the surface of the glass to be bonded is cleaned, dried, and glued on both sides to form an adhesive coating with a thickness of 1 mm. The bonding is carried out at 0 °C, and the adhesive is cured after 48 hours to obtain a good bonding. Glass A1; put the bonded glass A1 at 140 °C for 5 minutes, the cured adhesive becomes fluid, and the bonded glass A1 is released; the separated glass is bonded again in the original position, 3...

Embodiment 3

[0054] The raw materials are weighed according to the following parts by weight:

[0055] 60 parts of furfuryl alcohol resin,

[0056] 40 parts of m-phenylene bismaleimide;

[0057] The above-mentioned raw materials are placed in a container, mechanically stirred, the stirring speed is 120 rmp, the stirring temperature is 50 ° C, and the stirring time is 5 minutes, so that the components are dispersed evenly to form a uniform mixture, and the thermoreversible adhesive is prepared.

[0058] For polypropylene-polypropylene bonding:

[0059] Using polypropylene as the bonding material, the surface of the polypropylene to be bonded is cleaned, dried, and glued on both sides to form an adhesive coating with a thickness of 5 mm. Good polypropylene A1; put the bonded polypropylene A1 at 120 ° C for 15 minutes, the cured adhesive becomes fluid, and the bonded polypropylene is released; Bonding was performed, and after 24 h at 30° C., the adhesive was cured again, and the polypropyl...

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PUM

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Abstract

The invention belongs to the technical field of an adhesive and discloses a thermal reversible adhesive as well as a preparation method and an application thereof. The adhesive is prepared from following components in parts by weight: 40-90 parts of furan resin, 10-60 parts of maleimide, 0-30 parts of a solvent and 0-10 parts of an auxiliary agent. The preparation method comprises the following steps: weighing 40-90 parts of the furan resin, 10-60 parts of the maleimide, 0-30 parts of the solvent and 0-10 parts of the auxiliary agent; agitating and uniformly dispersing all the components to prepare the thermal reversible adhesive. A method for treating a binding material by the adhesive comprises the following steps: coating the thermal reversible adhesive on the surfaces of the two binding materials to form an adhering coating, wherein the thickness is 1-5mm, the treatment time lasts for 1-48 hours and the treatment temperature is 0-90 DEG C; binding the two binding materials; heating a binding part at 100-140 DEG C for 5-30 minutes to separate the two binding materials; after the binding materials are separated, treating for 1-48 hours at a treatment temperature in a range of 0-90 DEG C and binding the two binding materials again, wherein the processes of binding and separating can be repeatedly carried out. The thermal reversible adhesive disclosed by the invention has the advantages of acid resistance, alkali resistance, chemical corrosion resistance and the like.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and relates to a thermally reversible adhesive, a preparation method and applications thereof. Background technique [0002] Adhesives are widely used in real life and play a very important role. Patent CN1133706 discloses an aluminum-plastic composite hot-melt adhesive, which is composed of organic solvent, vinyl chloride-vinyl acetate-maleic anhydride terpolymer resin, ethylene-vinyl acetate copolyester, ethylene-ethyl acrylate copolyol and It is composed of multi-component copolyester. The hot melt adhesive has short curing time, modularity, high strength, and can be reused. However, it is not resistant to acid and alkali, and has many components and is complicated to prepare. Patent CN1231555 discloses a room temperature curing type high temperature adhesive, which has excellent high temperature resistance, but cannot be reused and requires high raw materials. SUMMARY OF THE INVENTION ...

Claims

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Application Information

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IPC IPC(8): C09J161/00C09J11/06C09J5/00
Inventor 杨桂生程伟孙利明
Owner HEFEI GENIUS NEW MATERIALS