Rigid-flex printed circuit board capable of protecting inner layer windowing area and production method thereof

Abstract

The invention discloses a rigid-flex printed circuit board capable of protecting an inner layer windowing area and a production method thereof and belongs to the technical field of rigid-flex printed circuit boards. The rigid-flex printed circuit board is characterized by comprising a flex board and rigid boards arranged on the upper lateral surface and the lower lateral surface of the flex board, and pads or golden fingers are arranged in a windowing area disposed on the flex board. Flex board cover films and pure adhesive films are sequentially arranged between the flex board and the rigid boards arranged on the upper lateral surface and the lower lateral surface of the flex board from inside to outside, cover film windows adaptive to the pads or the golden fingers are arranged on the flex board cover films, pure adhesive film windows adaptive to the windowing area are arranged on the pure adhesive films, and cover film protection layers are arranged between the pure adhesive films and the rigid boards. A plurality of cutting joints are arranged on the rigid boards at intervals along the outer contour of the windowing area. The rigid-flex printed circuit board is reasonable in structure, high in production efficiency and good in use effect and is used for producing printed circuit board products.

Description

Technical field [0001] The present invention relates to a rigid-flex board, and more particularly, to a rigid-flex board for protecting the inner window opening area. The invention also relates to a method for manufacturing the above-mentioned rigid-flex board. Background technique [0002] With the rapid development of electronic products toward high density and miniaturization, Rigid-flex Printed Circuit Board (Rigid-flex Printed Circuit Board) is a printed circuit board that is combined with a rigid board on different areas of the flexible board. The area realizes the electrical performance connection between the rigid board and the flexible board, because it has the characteristics of small size, movable, can meet the needs of three-dimensional packaging, and can significantly reduce the size and space of electronic packaging. It is used in aviation, computers, and digital cameras. , Mobile phones and other electronic devices have been widely used. The window area is a key ...

AI Technical Summary

Problems solved by technology

In order to solve the current problems of rigid-flex boards with gold fingers or pad structures in the inner window opening area, which are prone to short circuit, explosion after lamination, and low production efficiency, and improve the production of rigid-flex boards with gold fingers or pad structures High reliability and production efficiency, reduce production cost

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