Copper-titanium silicon carbon composite contact material as well as hot-pressing sintering preparation method and application thereof

A composite contact, hot pressing sintering technology, applied in the direction of contacts, electrical components, electrical switches, etc., can solve problems such as limited work, and achieve the effects of good electrical and thermal conductivity, high electrical contact performance, and tight bonding

Active Publication Date: 2013-11-13
BEIJING JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] So far, about Ti 3 SiC 2 The preparation and properties of materials have been researched at home and abroad, but the work done on the preparation and industrial application of composite materials with metals is still limited, and only a few articles about Ti 3 SiC 2 / Cu composite material paper and two related patents

Method used

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  • Copper-titanium silicon carbon composite contact material as well as hot-pressing sintering preparation method and application thereof
  • Copper-titanium silicon carbon composite contact material as well as hot-pressing sintering preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] 1. Titanium-silicon carbon powder: The purity of the titanium-silicon carbon powder used in this example is 94%, and the particle size of the powder is 15 μm.

[0026] 2. Copper powder: The copper powder used in this embodiment is commercially available high-purity copper powder with a purity greater than 99.5%, and the particle size of the powder is 200 mesh.

[0027] 3. Mix titanium-silicon carbon powder and copper powder according to the volume ratio of 7:3, weigh 54.23g of titanium-silicon carbon powder and 45.77g of copper powder, roll ball mill in anhydrous ethanol medium for 24h, weigh the mixed powder after drying Put 30g of the material into a graphite mold, pre-press molding at a pressure of 8 MPa, put the mold into a hot-press furnace protected by flowing argon, raise the temperature to 1020 °C at a rate of 30 °C / min, and keep it at a pressure of 30 MPa for 150 min.

[0028] The properties of the copper-titanium-silicon-carbon composite contact material prepa...

Embodiment 2

[0030] 1. Titanium-silicon carbon powder: The purity of the titanium-silicon carbon powder used in this example is 97%, and the particle size of the powder is 20 μm.

[0031] 2. Copper powder: The copper powder used in this embodiment is a commercially available high-purity copper powder with a purity greater than 99.5%, and the particle size of the powder is 300 mesh.

[0032] 3. Mix titanium-silicon carbon powder and copper powder according to the volume ratio of 6:4, weigh 43.24g of titanium-silicon carbon powder and 58.76g of copper powder, roll ball mill in anhydrous ethanol medium for 24 hours, weigh the mixed powder after drying Put 30g of the material into a graphite mold, pre-press molding at a pressure of 8MPa, put the mold into a hot-press furnace protected by flowing argon, raise the temperature to 1050°C at a rate of 30°C / min, and keep it at a pressure of 30MPa for 150min.

[0033] The properties of the copper-titanium-silicon-carbon composite contact material pre...

Embodiment 3

[0035] 1. Titanium-silicon carbon powder: The purity of the titanium-silicon carbon powder used in this example is 93%, and the particle size of the powder is 10 μm.

[0036] 2. Copper powder: the commercially available high-purity copper powder with a purity greater than 99.5% is used in this embodiment, and the particle size of the powder is 200 mesh.

[0037] 3. Mix titanium-silicon carbon powder and copper powder according to the volume ratio of 5:5, weigh 33.68g of titanium-silicon carbon powder and 66.32g of copper powder, roll ball mill in anhydrous ethanol medium for 36h, weigh the mixed powder after drying Put 30g of the material into a graphite mold, pre-press molding at a pressure of 8MPa, put the mold into a hot-press furnace protected by flowing argon, raise the temperature to 1020°C at a rate of 20°C / min, and keep it at a pressure of 25MPa for 120min.

[0038] The properties of the copper-titanium-silicon-carbon composite contact material prepared in this example...

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Abstract

The invention discloses copper-titanium silicon carbon composite contact material, which is prepared from the following components in the percent by volume: 20-70% of titanium silicon carbon powder and the balance of copper powder. The composite contact material provided by the invention has the advantages of good electrical conductivity and thermal conductivity, light weight, strategic resource tungsten saving and even tissue, the material consistency approaches to 100%; a matrix and a wild phase are tightly combined, and defects are extremely few; the composite contact material has excellent physical performance, mechanical property and electrical contact performance. The invention also discloses a method for preparing the copper-titanium silicon carbon composite contact material and an application of the copper-titanium silicon carbon composite contact material.

Description

technical field [0001] The invention relates to the field of copper-based electrical contact materials, in particular to a copper-titanium silicon carbon (Cu-Ti 3 SiC 2 ) Composite contact material and its preparation method and application by hot pressing and sintering. Background technique [0002] The electrical contact is the core component of the vacuum switch, which is responsible for the task of connecting, carrying and breaking current, and its performance directly affects the reliability, stability and accuracy of the conduction system. The performance of an electrical contact depends primarily on the contact material from which it is made. At present, the materials used to make vacuum contactor contacts mainly include silver-based contact materials and copper-based contact materials. The silver-based contact material has better performance, but the cost is greatly increased due to the use of precious metal silver. It is mainly used in more important vacuum conta...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/00B22F3/12H01H1/025H01H1/021
Inventor 周洋路金蓉孙建军陈树涛王占永贾晓伟高立强李世波李翠伟黄振莺翟洪祥
Owner BEIJING JIAOTONG UNIV
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