Method for cutting silicon ingot by squaring machine

Abstract

The invention provides a method for cutting a silicon ingot by a squaring machine. The method comprises the following steps of: selecting granularity of quartz sand of F360; adopting omeprazole stock solution; setting the slurry temperature to be 18-22 DEG C and the density of the slurry to be between 1.635 and 1.660; selecting with a structural line with the line diameter of 0.3 mm; cutting with tension of 90 N; starting a cutter at a starting section at a first preset speed and gradually increasing to a second preset speed; cutting at a working section at a third preset speed; gradually reducing the speed from the third preset speed to a fourth preset speed at an end section, wherein the first preset speed is less than the second preset speed, and the third preset speed is full speed and is greater than the fourth preset speed. According to the method, the cutting process of the machine tool is divided into three sections, low-speed cutting is performed at the starting section at the first preset speed, high-speed cutting is performed at the working section at the third preset speed, and the speed is reduced to the fourth preset speed at the end section; the cutting speed is improved at the working section through change of the cutting parameters, thus the machining time of the silicon ingot is shortened and the utilization rate of the equipment is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, and more specifically relates to a method for cutting silicon ingots by a squarer. Background technique [0002] Silicon is a very important semiconductor material, widely used in diodes, light emitting devices, solar cells and other fields. In the fast-growing photovoltaic industry, high efficiency and low cost have always been the two main points of competition, and crystalline silicon, as the current main solar cell material, has always occupied an absolute advantage due to its high efficiency and stability. [0003] Since the silicon ingots produced are large-sized silicon blocks, in order to facilitate subsequent processing and obtain silicon blocks of specified size, it is necessary to cut large-sized silicon ingots. The squarer is to cut large-sized silicon ingots into specified sizes. The cutting principle of the silicon block equipment is to use the structural wires to ...

AI Technical Summary

Problems solved by technology

It can be seen from the data that the overall speed of using this structure line to carry the mortar cutting method is too slow, and the processing cycle of the silicon ingot is long, which affects the production capacity of the equipment

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