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Preparation method for prefabricated SiC component used for SiC-reinforced Al-based composite material

A technology for composite materials and prefabricated parts, which is applied in the field of preparation of electronic packaging materials, can solve the problems of decreased mechanical strength of composite materials, inability of organic binders to withstand high temperature, toxicity of organic binders, etc., and achieves improved mechanical strength and equipment requirements. Low, low cost effect

Inactive Publication Date: 2013-12-11
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Among them, most of the organic binders are toxic, which is easy to cause environmental pollution and other problems, and the organic binders cannot withstand high temperatures, and lose their effect due to high temperatures during the impregnation process, resulting in a decrease in the mechanical strength of the composite material; mixing various inorganic reagents After the reaction, it is used as a binder, which increases the process flow and reduces the production efficiency

Method used

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  • Preparation method for prefabricated SiC component used for SiC-reinforced Al-based composite material
  • Preparation method for prefabricated SiC component used for SiC-reinforced Al-based composite material
  • Preparation method for prefabricated SiC component used for SiC-reinforced Al-based composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The method for preparing the SiC prefabricated part for SiC reinforced Al-based composite material of this embodiment comprises the following steps:

[0026] (1) Add the pore-forming agent starch to the binder analytically pure Al(H 2 PO 4 ) 3 , mix uniformly to obtain a uniform mixture; add the homogeneous mixture to the ɑ-SiC raw material, mix uniformly again, and obtain the prefabricated material after drying and sieving; the quality of the starch is ɑ-SiC raw material, bonding 5% of the sum of the mass of the binder and the starch; the mass of the binder is 9% of the sum of the mass of the ɑ-SiC raw material, the binder and the starch; the ɑ-SiC raw material is ɑ-SiC particles with a particle size of 50 μm ;

[0027] (2) Put the preform material obtained in step (1) into a mold, and use a hydraulic press to form a wet SiC preform; the process parameters of the compression molding are: the pressure is 50Mpa, and the pressure is kept for 3 minutes.

[0028] (3) Th...

Embodiment 2

[0039] In this example, 4 groups of samples were prepared. Except for the mass percentage of the pore-forming agent (the percentage of the pore-forming agent in the sum of the mass of the ɑ-SiC raw material, binder and starch) of each group of samples, the rest of the characteristics of the preparation method were the same as those in the embodiment. 1, the obtained porosity test results are shown in Table 3.

[0040] Table 3 Porosity of samples with different mass fractions of pore formers

[0041]

Embodiment 3

[0043] The method for preparing the SiC prefabricated part for SiC reinforced Al-based composite material of this embodiment comprises the following steps:

[0044] (1) Add the pore-forming agent starch to the binder analytically pure Al(H 2 PO 4 ) 3 , mix uniformly to obtain a uniform mixture; add the homogeneous mixture to the ɑ-SiC raw material, mix uniformly again, and obtain the prefabricated material after drying and sieving; the quality of the starch is ɑ-SiC raw material, bonding 4% of the sum of the mass of the binder and the starch; the mass of the binder is 7% of the sum of the mass of the ɑ-SiC raw material, the binder and the starch; the ɑ-SiC raw material is ɑ-SiC particles with a particle size of 50 μm ;

[0045] (2) Put the prefabricated material obtained in step (1) into a mould, and use a hydraulic press to form a preformed wet body; the process parameters of the compression molding are: the pressure is 40Mpa, and the pressure is maintained for 2 minutes. ...

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Abstract

The invention discloses a preparation method for a prefabricated SiC component used for a SiC-reinforced Al-based composite material. The preparation method comprises the following steps: (1) adding pore forming agent starch into the binder analytically pure Al(H2PO4)3, carrying out uniform mixing so as to obtain a uniform mixture, adding the uniform mixture into an alpha-SiC raw material, carrying out uniform mixing again and drying and sieving an obtained mixture so as to obtain a material for the prefabricated component; (2) filling the material for the prefabricated component obtained in step (1) into a die and carrying out compression molding by using a hydraulic press so as to obtain a wet blank of the prefabricated SiC component; and (3) sintering the wet blank of the prefabricated SiC component obtained in step (2) so as to obtain the prefabricated SiC component. The preparation method provided by the invention has the advantages of strong operationality, easiness, practicability, low cost and easy control; and the prefabricated SiC component prepared by using the method has appropriate porosity, uniform pore distribution and high mechanical strength and is easy to control and sufficient to meet demands for subsequent liquid phase infiltration of Al.

Description

technical field [0001] The invention relates to a preparation method of an electronic packaging material, in particular to a preparation method of a SiC prefabricated part used for SiC reinforced Al-based composite materials. Background technique [0002] With the development of microelectronic devices in the direction of high performance, light weight and miniaturization, microelectronics puts forward more and more stringent requirements for packaging materials. Traditional packaging materials include silicon substrates, metal substrates, and ceramic substrates. Silicon and ceramic substrates are difficult to process, high in cost, and low in thermal conductivity; the thermal expansion coefficient of metal materials does not match that of microelectronic chips, which will cause thermal stress and warp during use. Therefore, it is difficult for these traditional packaging materials to meet the demanding requirements of packaging substrates. Newly developed heat dissipation...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/565C04B38/06C04B35/622C22C21/00C22C1/10
Inventor 李国强刘玫潭凌嘉辉刘家成
Owner SOUTH CHINA UNIV OF TECH
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