High-performance nano thermal insulation materials with ultralow heat conductivity coefficients and preparation method thereof

A technology of nano-insulation materials and thermal conductivity, which is applied in heat exchange equipment, chemical instruments and methods, and pipelines through heat insulation protection, can solve the problems of low heat insulation rate per unit volume, lack of load capacity, etc., and increase heat Effects of radiation, improved heat insulation performance, and a wide range of applications

Active Publication Date: 2013-12-11
SICHUAN AEROSPACE SYST ENG INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] One of the purposes of the present invention is to address the above-mentioned deficiencies, to provide a high-performance nano-insulation material with ultra-low thermal conductivity and its preparation method, in order to solve the problem of low thermal insulation rate per unit volume of existing heat-insulation materials, and lack of Bearing capacity and other technical issues

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] a. Barrier film: aluminum film, polyester film;

[0027] b. Thermal insulation filler with low thermal conductivity: glass wool (40%wt), glass fiber (30%wt), nano-silica (30%wt);

[0028] c. Low thermal conductivity matrix material: none;

[0029] d. Preparation process:

[0030] 1) Hot-compress the polyester film and the aluminum film or directly purchase the aluminum-coated polyester film;

[0031] 2) loading nano silicon dioxide and glass fiber on the glass wool carrier;

[0032] 3) Place the thermal insulation component loaded with low thermal conductivity filler on the barrier film, vacuumize until the barrier film and the thermal insulation component are fully bonded, heat-press seal or use methyl vinyl silicone rubber to seal;

[0033] The technical indicators that can be achieved after testing in this example are:

[0034] e. Thermal conductivity index: thermal conductivity ≤ 0.008W / m·K.

[0035] f. Mechanical properties: bending ≥ 450N.

Embodiment 2

[0037] a. Barrier film: aluminum film, polypropylene film;

[0038] b. Low thermal conductivity thermal insulation filler: glass wool (70%wt), nano-silica airgel (30%wt);

[0039] c. Low thermal conductivity matrix material: glass fiber cloth;

[0040] d. Preparation process:

[0041] 1) Hot-compress the polypropylene film and the aluminum film or directly purchase the aluminum-coated polypropylene film;

[0042] 2) loading nano silicon dioxide and glass fiber on the glass wool carrier;

[0043] 3) Place the thermal insulation component loaded with low thermal conductivity filler on the barrier film, vacuumize until the barrier film and the thermal insulation component are fully bonded, heat-press seal or use methyl vinyl silicone rubber to seal;

[0044] The technical indicators that can be achieved after testing in this example are:

[0045] e. Thermal conductivity index: thermal conductivity ≤0.007W / m·K.

[0046] f. Mechanical properties: bending ≥ 650N.

Embodiment 3

[0048] a. Hot-compress the polyester film and the aluminum film or directly purchase the aluminum-coated polyester film;

[0049] b. Low thermal conductivity thermal insulation filler: glass wool (70%wt), nano airgel (30%wt);

[0050] c. Low thermal conductivity matrix material: aramid fiber cloth;

[0051] d. Preparation process:

[0052] 1) Hot-compress the polypropylene film and the aluminum film or directly purchase the aluminum-coated polypropylene film;

[0053] 2) loading the nano airgel on the glass wool carrier;

[0054] 3) Place the thermal insulation component loaded with low thermal conductivity filler on the barrier film, vacuumize until the barrier film and the thermal insulation component are fully bonded, heat-press seal or use methyl vinyl silicone rubber to seal;

[0055] The technical indicators that can be achieved after testing in this example are:

[0056] e. Thermal conductivity index: thermal conductivity ≤ 0.005W / m·K.

[0057] f. Mechanical proper...

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Abstract

The invention discloses high-performance nano thermal insulation materials with ultralow heat conductivity coefficients and a preparation method of the high-performance nano thermal insulation materials, and belongs to a thermal preservation and insulation material. The thermal insulation materials at least comprise thermal insulation padding, a barrier film coats the thermal insulation padding, the inner portion of the barrier film is in a vacuum state, and the barrier film is in close contact with the thermal insulation padding under the action of vacuum. A vacuum thermal insulation structure formed by the composite thermal insulation padding is adopted to improve thermal radiation, the thermal insulation performance of thermal insulation materials is effectively improved, the thermal insulation performance of the materials can be further improved with the assistance of all kinds of aerogel, and the heat conductivity coefficients obtained by the experiment of the inventor can reach 0.005W/m*K. In addition, the supporting structure inside the thermal insulation materials is optimized through a nano composite material technology, the thermal insulation materials are made to have certain bearing capacity, and meanwhile the materials are especially suitable for being used as the thermal insulation and thermal preservation materials in a sealed-space thermal insulation system with a limited size, can also be used in other devices or appliances to carry put thermal preservation and insulation, and are wide in application range.

Description

technical field [0001] The invention relates to a thermal insulation material, more specifically, the invention mainly relates to a high-performance nano thermal insulation material with ultra-low thermal conductivity and a preparation method thereof. Background technique [0002] Due to the limited volume of some sealed spaces, in order to save space, it is necessary to use a thermal insulation structure with an ultra-low thermal conductivity to reduce the volume occupancy and weight of the thermal insulation structure, thereby improving space utilization efficiency. At present, commonly used thermal insulation materials include polyurethane foam (thermal conductivity of 0.03W / m·K-0.04W / m·K), asbestos (thermal conductivity of 0.038W / m·K-0.047W / m·K), polyester Styrene foam (thermal conductivity 0.033W / m·K-0.044W / m·K), traditional vacuum insulation structure (thermal conductivity 0.0025W / m·K-0.004W / m·K), etc. However, the traditional vacuum insulation structure cannot be use...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F16L59/02F16L59/05F16L59/065B32B37/10
Inventor 罗文洲郭峰陈粤海石继梅蒋琳
Owner SICHUAN AEROSPACE SYST ENG INST
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