Aluminum heat radiating module of LED (Light Emitting Diode)

Abstract

The invention provides an aluminum heat radiating module of an LED (Light Emitting Diode). The aluminum heat radiating module of the LED comprises an aluminum heat radiator, an LED chip and a common PCB (Printed circuit board), wherein circuit bonding pads which correspond to two electrodes of the LED chip are arranged on an electricity conducting layer of the common PCB; a heat conducting face is arranged on the aluminum heat radiator; a concave camber for the arrangement of the common PCB is arranged in a position near the heat conducting face; the common PCB board is arranged inside the concave camber of the heat radiator; the insulating face of the LED chip is adhered onto a corresponding part of the heat conducting face of the aluminum heat radiator by adopting bonding glue; the two electrodes of the LED chip and the two circuit bonding pads on the common PCB are correspondingly connected by electricity conducting wires. The aluminum heat radiating module of the LED provided by the invention is convenient to manufacture and has a good heat radiation effect.

Description

【Technical field】 [0001] The invention belongs to the technical field of LEDs, and in particular relates to an aluminum heat dissipation module for LEDs. 【Background technique】 [0002] LED industry division of labor: LED epitaxial wafer generation - LED chip preparation - LED bead packaging - LED lamp assembly. [0003] LED has high luminous efficiency, but because the LED chip is small in size, it will generate high heat during operation. The heat of the LED chip must be efficiently exported through heat conduction and heat convection to reduce the junction temperature of the chip. [0004] At present, the heat dissipation technology of LED chips adopts three methods: 1. Fix the LED chips on the bracket to form LED beads, weld the LED beads on the PCB aluminum substrate, and fix the PCB aluminum substrate on the radiator; 2. COB method, that is, multiple Two LED chips are densely arranged on the PCB aluminum substrate, and the PCB aluminum substrate is fixed on the radiat...

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Problems solved by technology

[0005] Chinese utility model patent 201020189425.9 discloses a LED ceramic heat sink, Chinese utility model patent 201210044889.4 discloses a high-power LED lamp using ceramic heat dissipation, and Chinese utility model patent 201120028108.3 discloses a ceramic heat sink that improves LED heat dissipation efficiency. All of them use ceramic materials, the manufacturing process is complicated, the production efficiency is low, and the cost is high

[0006] Chinese invention patent 201210174071.4 discloses a LED lamp module and method for packaging LED chips on a heat dissipation support carrier circuit. Since the circuit includes a metal circuit layer and an insulating layer bonded together, and the insulating layer of the circuit is bonded with an adhesive Junction on the three-dimensional heat dissipation support lamp carrier, therefore, there is also an insulating layer and adhesive with low thermal conductivity and large thermal resistance between the heat of the LED chip and the heat sink (that is, the three-dimensional heat dissipation support lamp carrier), so the heat conduction effect is also very poor

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