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Cyanate ester composition and method for preparing copper-clad laminates using it

A technology of cyanate ester and composition, which is applied in the field of preparing copper clad laminates, can solve the problems of voids and white spots, poor adhesion between insulating materials and copper foil, polymers can not effectively fill the gap between prepreg and copper foil, etc. problem, to achieve excellent dielectric properties and improve compatibility

Active Publication Date: 2016-06-01
汕头超声覆铜板科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] As a high-molecular-weight thermoplastic resin, polyphenylene ether resin has a relatively high melting point. If a simple mixture of polyphenylene ether and cyanate is used to make a prepreg for copper-clad laminates, it will be hot-pressed to manufacture printed circuits. When the board is used, due to the high viscosity of high molecular weight polyphenylene ether, the fluidity of the prepreg is too low, which makes the adhesion between the insulating material and the copper foil poor, and the polymer cannot effectively fill the prepreg and the copper foil. spaces between, which can easily lead to voids and white spots

Method used

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  • Cyanate ester composition and method for preparing copper-clad laminates using it
  • Cyanate ester composition and method for preparing copper-clad laminates using it
  • Cyanate ester composition and method for preparing copper-clad laminates using it

Examples

Experimental program
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Effect test

Embodiment 1

[0034] Add 100 parts of polyphenylene ether, 9.5 parts of bisphenol A, and then add 150 parts of toluene into a four-neck flask, heat to 100°C, and stir with a stirring bar until it dissolves and becomes transparent. 4 parts of benzoyl peroxide were dissolved in toluene, and dropped into the reaction vessel dropwise, and the reaction continued for 100 minutes. Nitrogen gas flow was maintained throughout the process. When the reaction is over, the product is precipitated with methanol and filtered to obtain a low-molecular-weight polyphenylene ether capped with phenolic hydroxyl groups.

[0035] Select 65 parts of the above polyphenylene ether, add 75 parts of toluene, stir and heat to 100°C until it is completely dissolved, add 35 parts of dicyclopentadiene monomer, and stir until the solution is uniform. Then add 100 parts of cyanate ester and 0.12 parts of organometallic salt catalyst while keeping the solution temperature at 97-103°C. After all the solutions are added, the...

Embodiment 2

[0037] Add 100 parts of polyphenylene ether, 9.5 parts of bisphenol A, and then add 150 parts of toluene into a four-neck flask, heat to 100°C, and stir with a stirring bar until it dissolves and becomes transparent. 4 parts of benzoyl peroxide were dissolved in toluene, and dropped into the reaction vessel dropwise, and the reaction continued for 100 minutes. Nitrogen gas flow was maintained throughout the process. When the reaction is over, the product is precipitated with methanol and filtered to obtain a low-molecular-weight polyphenylene ether capped with phenolic hydroxyl groups.

[0038] Select 80 parts of the above polyphenylene ether, add 65 parts of toluene, stir and heat to 100°C until it is completely dissolved, add 20 parts of styrene monomer, and stir until the solution is uniform. Then add 100 parts of cyanate ester and 0.08 parts of organometallic salt catalyst while keeping the solution temperature at 97-103°C. After all the solutions are added, the solution ...

Embodiment 3

[0040] Add 100 parts of polyphenylene ether, 9.5 parts of bisphenol A, and then add 150 parts of toluene into a four-neck flask, heat to 100°C, and stir with a stirring bar until it dissolves and becomes transparent. 4 parts of benzoyl peroxide were dissolved in toluene, and dropped into the reaction vessel dropwise, and the reaction continued for 100 minutes. Nitrogen gas flow was maintained throughout the process. When the reaction is over, the product is precipitated with methanol and filtered to obtain a low-molecular-weight polyphenylene ether capped with phenolic hydroxyl groups.

[0041] Select 50 parts of the above polyphenylene ether, add 65 parts of toluene, stir and heat to 100°C until it is completely dissolved, add 100 parts of styrene monomer, and stir until the solution is uniform. Then add 100 parts of cyanate ester and 0.12 parts of organometallic salt catalyst while keeping the solution temperature at 97-103°C. After all the solutions are added, the solution...

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Abstract

The invention discloses a cyanate ester composition. Specifically, the cyanate ester composition comprises cyanate ester, low-molecular weight polyphenylene oxide / polyphenylene ether, an olefin monomer, an organic metal salt catalyst, an inorganic filling material, an environmental-friendly fire retardant and an organic solvent. The invention also discloses copper-clad plates made of the cyanate ester composition, and a method used for preparing the copper-clad plates by the cyanate ester composition. Low-molecular weight polyphenylene oxide / polyphenylene ether which is obtained by redistribution reaction is used in the cyanate ester composition, so that a problem of poor fluidity of large-molecular weight polyphenylene oxide / polyphenylene ether is solved; in addition, the olefin monomer is added for further improvement of compatibility of the system, and dielectric properties of the system are not influenced. The cyanate ester composition can be used for preparation of the high-performance copper-clad plates which are green and friendly to the environment. The copper-clad plates possess excellent dielectric properties, heat resistance and environmental-friendly fire resistance.

Description

technical field [0001] The invention relates to the field of composite materials, in particular to a method for preparing copper-clad laminates from a composition using cyanate resin as a matrix resin. Background technique [0002] With the high integration of semiconductor devices and the refinement of packaging technology, the high density of printed circuit boards, and the advancement of connection and installation technologies, electronic devices are significantly miniaturized, high-frequency, high-speed digital, and high-reliable. Direction of development, especially in the field of high-frequency mobile communications. Printed circuit boards, as the base material of electronic devices, have recently developed towards multi-layer and ultra-thin circuits, so the transmission speed of signals must be faster and faster, and the frequency of signals is also higher and higher, so this also requires The printed circuit board material used as a signal transmission carrier mus...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/04C08L71/12C08K13/02C08K5/01C08K5/523C08K5/521C08G65/48B32B15/08B32B27/04B32B27/06
Inventor 李柳斌郭瑞珂王岳群
Owner 汕头超声覆铜板科技有限公司
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